1 Conductor defects
1-1 Electrical open
1-1-1 Caused by foreign object(electrical open)
1-1-1-1 Single open by a foreign object
1-1-1-2 Multiple opens caused by a foreign object
1-1-1-3 Threadlike open
1-1-1-4 Conductor-pattern-like open
1-1-1-5 Convex open
1-1-1-6 Concave open
1-1-1-7 Needle-shaped open
1-1-1-8 An open tailing caused by a foreign object
1-1-1-9 Convex tailing open
1-1-1-10 Open caused by residual adhesive
1-1-1-11 Groove-shaped open
1-1-1-12 Multiple tailed open
1-1-1-13 Open by defective plating by an attached foreign object
1-1-1-14 Internal layer open
1-1-2 Caused by damages to the board(Electrical open)
1-1-2-1 Deformed and broken open
1-1-2-2 Open by impact cracking
1-1-2-3 Open along scratch
1-1-2-4 Open by impact scrape
1-1-2-5 Open by damaged surface of internal base material
1-1-3 Caused by scratches(Electrical open)
1-1-3-1 Open caused by scratch on board
1-1-3-2 Open by abrasion scratch
1-1-3-3 Open by handling scratch
1-1-3-4 Open by electrostatic discharge
1-1-3-5 Opens by multiple scratches
1-1-3-6 Open by damaged base material
1-1-4 PTH opens
1-1-4-1 Open PTH by broken tenting
1-1-4-2 PTH open by etching of conductor by residual chemical
1-1-4-3 PTH open by mechanical shock
1-1-4-4 PTH open by trapped bubble
1-1-4-5 PTH open by delamination
1-1-4-6 PTH open by land break
1-1-4-7 PTH open by trapped bubble in rugged hole
1-1-4-8 PTH open by plugging of a foreign object
1-1-4-9 PTH open by resin smear on via bottom land
1-1-4-10 PTH open by circumferential resin smear
1-1-4-11 Open by absence of blind via hole
1-1-4-12 Open by etched down blind via
1-1-4-13 Open by non-plated blind via
1-1-5 Others(Electrical open)
1-1-5-1 Open by improper hole on conductor
1-1-5-2 Open by a dislocated V groove
1-1-5-3 Open by torn-off and sticked conductor
1-1-5-4 Open by poor dry film adhesion
1-1-5-5 Open by flexural fatigue of FPC
1-1-6 Quasi open
1-1-6-1 Quasi open by nicking
1-1-6-2 Quasi open by dissolution
1-1-6-3 Dish shaped quasi open
1-1-6-4 Quasi open by sandwiched adhesive
1-1-6-5 Quasi open by electrostatic discharge
1-1-6-6 Quasi PTH open
1-1-6-7 Quasi open by abrasion scratch
1-2 Nicks
1-2-1 Caused by foreign objects(nicks)
1-2-1-1 Isolated nick by foreign object
1-2-1-2 Conductor nick and adjacent open by foreign object
1-2-1-3 Adjacent nicked conductors by foreign object
1-2-1-4 Tailed nick by a foreign object
1-2-1-5 Round nick by dent
1-2-1-6 Nick by residual adhesive
1-2-1-7 Dish shaped nick
1-2-1-8 Nick by adhesive sandwiching
1-2-1-9 Nick by dent on base material
1-2-1-10 Nick of edge edge contact by a foreign object
1-2-1-11 Nick by hair
1-2-1-12 Nick by dent
1-2-1-13 Nick of Inner layer conductor
1-2-2 Resulted from other causes(nicks)
1-2-2-1 Nick by board surface damage
1-2-2-2 Nick by poor dry film adhesion
1-2-2-3 Nick by electrostatic discharge
1-2-2-4 Nick by base material dent
1-2-2-5 Nick by board damage
1-2-2-6 Chipping by stained AWF Nick by stained phototool
1-2-2-7 Hole break-out by misalignment
1-2-2-8 Rough edged conductor
1-2-2-9 Nick of fiducial mark
1-2-2-10 Etched copper of base material
1-2-2-11 Nick by tearing around large hole
1-2-2-12 Nick by tear and transfer of conductor
1-2-2-13 Nick of carbon printed pattern
1-2-2-14 Chipping by poor DFR adhesion on plugged hole Conductor nick on a plugged hole by poor
dry film adhesion
1-3 Pinhole
1-3-1 Caused by foreign objects(pinhole)
1-3-1-1 Pinhole
1-3-1-2 Pit
1-3-2 Others(pinhole)
1-3-2-1 Pinhole by electrostatic discharge
1-3-2-2 Pinhole by stained phototool
1-3-2-3 Pinhole by tear and transfer of conductor
1-4 Conductor width reduction
1-4-1 Caused by over etch(Conductor width reduction)
1-4-1-1 Reduced width throughout the conductor width
1-4-1-2 Locally reduced width of conductor
1-4-2 Caused by poor dry film adhesion(Conductor width reduction)
1-4-2-1 Reduced conductor width by poor dry film adhesion
1-4-3 Caused by defective phototool(Conductor width reduction)
1-4-3-1 Reduced conductor width by a defective phototool
1-5 Conductor protrusion
1-5-1 Caused by foreign objects(conductor protrusion)
1-5-1-1 Projected conductor by a defective phototool
1-5-1-2 Projected conductor by exposing light leakage
1-5-1-3 Projected conductor by scam
1-5-1-4 Projected conductor by sludge
1-5-1-5 Projected conductor by adhesive on CCL surface
1-5-1-6 Projected conductor by adhesive on plated surface
1-5-1-7 Projected conductor by prepreg debris
1-5-1-8 Outward conductor projection by adhered debris
1-5-1-9 Conductor projection by adhered debris
1-5-1-10 Rough plating
1-5-1-11 Plating nodule
1-5-1-12 Whisker
1-5-1-13 Projected conductor by debris of carrier film adhesive
1-5-1-14 Projected conductor by adhesives
1-5-2 Caused by incomplete etching
1-5-2-1 Projected conductor by improper pattern configuration
1-5-2-2 Projected conductor by etching nozzle clogging
1-5-3 Others(conductor protrusion)
1-5-3-1 Projected conductor by damaged board
1-5-3-2 Projected conductor by etching of conductor
1-5-3-3 Sliver
1-5-3-4 Projected conductor from laser drilled hole
1-5-3-5 Projected conductive paste jumper
1-5-3-6 Adhered and projected conductor
1-5-3-7 Projected conductor by through-hole burr
1-5-3-8 Granular nodule on gold plated surface
1-6 Residual copper
1-6-1 Caused by foreign objects(residual copper)
1-6-1-1 Scum or sludge-like residual copper
1-6-1-2 Residual copper under prepreg debris
1-6-1-3 Residual copper under paste adhered on laminated copper foil
1-6-1-4 Residual copper by carrier-film adhesive residue
1-6-1-5 Residual copper in laminate
1-6-1-6 Residual copper by a foreign object in laminate
1-6-2 Others(residual copper)
1-6-2-1 Residual copper by clogged etching nozzle
1-6-2-2 Residual copper on board border area
1-7 Expanded copper
1-7-1 Caused by foreign objects(expanded copper)
1-7-1-1 Expanded conductor by photographic fogging
1-7-2 Caused by irregular etching(Expanded copper)
1-7-2-1 Expanded conductor by excessive etching-conveyor speed
1-7-2-2 Expanded conductor by deteriorated etchant
1-7-3 Others(Expanded copper)
1-7-3-1 Narrow spacing between edge board contacts
1-7-3-2 Expanded conductor by photographic thermal fogging
1-8 Electrical short
1-8-1 Caused by foreign objects on the copper surface of laminate(Electrical short)
1-8-1-1 Short by adhesive foreign material
1-8-1-2 Short by tape adhesive
1-8-1-3 Short by carrier film adhesive
1-8-1-4 Short by prepreg debris
1-8-2 Caused by foreign adhesive objects on plated surface(Electrical short)
1-8-2-1 Short by dry film scum
1-8-2-2 Short by sludge
1-8-2-3 Short by adhered adhesive
1-8-3 Caused by photographic fogging
1-8-3-1 Short by a foreign object under a phototool
1-8-3-2 Short by bubble under phototool
1-8-3-3 Short by photographic fogging on rough plating
1-8-3-4 Short by poor phototool contact
1-8-3-5 Short by scratch on phototool
1-8-3-6 Short by photographic fogging by an adhered fibrous object
1-8-4 Others(Electrical short)
1-8-4-1 Short by an adhered conductive foreign object
1-8-4-2 Short by a conductive foreign object within solder resist
1-8-4-3 Short by damaged conductor
1-8-4-4 Short by wicking
1-8-4-5 Migration within resin
1-8-4-6 Migration at interface
1-8-4-7 Migration along glass cloth surface (CAF = Conductive Anodic Filament)
1-8-4-8 Migration along void
1-8-4-9 Short by clogged etching nozzle
1-8-4-10 Short by solder bridge
1-8-4-11 Layer-to-layer short by a conductive foreign object
1-8-4-12 Short by narrowed conductor spacing
1-8-4-13 Conductor pattern-like short
1-8-4-14 Short by misaligned via hole
1-8-4-15 Quasi short
1-8-4-16 Quasi short by copper debris between conductor
1-8-4-17 Short between carbon paste conductors
1-8-4-18 Quasi short by misaligned via hole
1-8-4-19 Short by improper conductive pattern
1-9 Others(conductor defects)
1-9-1 Deformed conductor by board damage
1-9-2 Torn off conductor
1-9-3 Abnormal conductor pattern
2 Solder resist defects
2-1 Improper work(Solder resist defects)
2-1-1 Caused by unskilled work(Solder resist defects)
2-1-1-1 Solder resist misalignment
2-1-1-2 Phototool misalignment
2-1-1-3 Inaccurate coverlay placement
2-1-1-4 Solder resist blur
2-1-1-5 Solder resist (spread) ooze
2-1-1-6 Wrong solder resist ink
2-1-1-7 Solder resist ink drop
2-1-1-8 Air entrapped in solder resist
2-1-1-9 Entirely underdeveloped photo solder resist
2-1-1-10 Partially underdeveloped photo solder resist
2-1-1-11 Solder resist dripped in non-plated through hole
2-1-1-12 Solder resist dripped in plated through hole
2-1-1-13 Via hole clogged with solder resist
2-1-1-14 Via hole clogged partially with solder resist
2-1-1-15 Local uneven colour of solder resistcolour
2-1-1-16 Solder resist crack
2-1-2 Caused by careless mistake
2-1-2-1 Solder resist blur by ink run-out
2-1-2-2 Contact mark on solder resist
2-1-2-3 Abrasion mark on solder resist
2-1-2-4 Dent on solder resist
2-1-2-5 Dent on coverlay
2-1-2-6 Dent on solder resist on aluminum-base printed board
2-1-2-7 Peeled off solder resist on iron-base printed board
2-1-2-8 Peeled off solder resist by impact
2-1-2-9 Contact mark on iron-base printed board
2-1-2-10 Scratch on solder resist
2-1-2-11 A scratch on solder resist of FPC
2-1-2-12 Scratch on coverlay
2-1-2-13 Nick on solder resist
2-1-2-14 Scratch on solder resist by board pulling
2-1-2-15 Scratch on solder resist of iron-base board by board pulling
2-1-2-16 Drop of solder resist ink
2-1-2-17 Soils rubbed on solder resist surface
2-1-2-18 Ink drop and run on solder resist surface
2-1-2-19 Fingerprint on solder resist surface
2-1-2-20 Superfluous solder resist by screen with partially peeled emulsion
2-1-2-21 Pasty foreign object on solder resist surface
2-1-2-22 Tape left on solder resist surface
2-1-2-23 Solder resist surface contaminated with marker pen ink
2-1-2-24 Foreign objects on FPC surface
2-1-2-25 Dirty FPC surface
2-1-2-26 Dirty base material under solder resist
2-1-2-27 Pasty foreign material under solder resist
2-1-2-28 Fingerprint on base material under solder resist
2-1-2-29 Tape left under solder resist
2-1-2-30 "X" mark on the base material under solder resist
2-1-2-31 Marker pen mark on base material under solder resist
2-1-2-32 Scratch on the conductor under solder resist
2-1-2-33 Scratch on base laminate under solder resist
2-1-2-34 Discoloured copper foil under coverlay
2-1-2-35 Fingerprint on the solder resist surface
2-1-2-36 Overcured solder resist
2-1-2-37 Conductor pattern transferred on solder resist
2-1-2-38 Threadlike photo solder resist residue on edge board contact
2-1-2-39 Spotty peeling of solder resist
2-1-2-40 Ink-stained conductor under solder resist
2-2 Caused by foreign objects(solder resist defects)
2-2-1 Foreign object remained (solder resist defects)
2-2-1-1 Attached hair on solder resist
2-2-1-2 Attached fibre on solder resist
2-2-1-3 A foreign object under coverlay
2-2-1-4 Ceiling dust on solder resist
2-2-1-5 A non-metal foreign object trapped in solder resist
2-2-1-6 Small insect body on solder resist
2-2-1-7 A metallic foreign object in solder resist
2-2-1-8 Cured ink debris on solder resist
2-2-1-9 Human-originated foreign object
2-2-1-10 Peeled paint debris in solder resist
2-2-1-11 Board debris in solder resist
2-2-1-12 Dry film debris on base material under solder resist
2-2-1-13 Attached solder on solder resist area
2-2-1-14 Cratered solder resist
2-2-1-15 Adhesive material on solder resist surface
2-2-2 Marks of foreign object(solder resist defects)
2-2-2-1 Solder resist missing on iron-base printed board due to a peeled foreign object
2-2-2-2 Solder resist missing at a peeled foreign object
2-2-2-3 Photo solder resist missing caused by a foreign object
2-2-2-4 Solder resist pinhole
2-2-2-5 Solder resist missing by bubble
2-2-2-6 Blistered solder resist
2-3 Others(solder resist defects)
2-3-1 Caused by improper equipment(solder resist defects)
2-3-1-1 Peeled solder resist by tacking
2-3-1-2 Equipment contact mark on solder resist
2-3-1-3 Abrasion mark on basis metal under solder resist
2-3-1-4 Pinch mark on solder resist
2-3-1-5 Scratch on solder resist by HAL
2-3-1-6 Scratch on solder resist of the equipment
2-3-1-7 Partially uneven solder resist
2-3-1-8 Scraped solder resist on iron-base printed board
2-3-2 Others
2-3-2-1 Solder resist left on conductor to be exposed
2-3-2-2 Insufficient solder resist thickness at a conductor edge
2-3-2-3 Fine scratch on solder resist on iron-base printed board
2-3-2-4 Solder resist missing between conductors
2-3-2-5 Peeled solder resist along localy plated gold deposited boundary
2-3-2-6 No solder resist on conductor defect
2-3-2-7 Uneven solder resist surface caused by electrostatic discharge
2-3-2-8 Cut on the basis conductor under solder resist by electrostatic discharge
2-3-2-9 Photo solder resist residue after electrostatic coating
2-3-2-10 Dry film residue in an FPC hole
2-3-2-11 Bubble under FPC coverlay
2-3-2-12 Solder resist cracking in a narrow area
2-3-2-13 Whitened solder resist by insufficient ink filling
3 Symbol mark defects
3-1 Improper printing work(Symbol mark defects)
3-1-1 Caused by unskilled work(Symbol mark defects)
3-1-1-1 Blurred symbol mark
3-1-1-2 Spread symbol mark
3-1-1-3 Peeled symbol mark
3-1-1-4 Unevenly coloured symbol mark
3-1-1-5 Pinhole in symbol mark
3-1-1-6 Symbol mark over edge board contact
3-1-2 Caused by careless mistake(Symbol mark defects)
3-1-2-1 Displaced symbol mark
3-1-2-2 Rubbed symbol mark
3-1-2-3 Deformed symbol mark
3-1-2-4 Reversely printed symbol mark
3-1-2-5 Wrong coloured symbol mark
3-1-2-6 Transferred symbol mark
3-1-2-7 Soil of symbol mark ink
3-1-2-8 Partly unprinted symbol mark
3-1-2-9 Overcured symbol mark
3-1-2-10 Chipped symbol mark by screen clogging
3-2 Others(symbol mark defects)
3-2-1 Caused by foreign objects(symbol mark defects)
3-2-1-1 Peeled symbol mark
3-2-1-2 Soil by symbol mark ink
3-2-1-3 Chipped symbol mark by a detached foreign object
3-2-1-4 Dirty symbol mark surface
3-2-1-5 Exposed copper in peeled symbol mark print
3-2-2 Others(symbol mark defects)
3-2-2-1 Symbol mark ink filled hole
3-2-2-2 Splashed symbol mark ink by electrostatic charge
3-2-2-3 Symbol mark blister
4 Plating defects
4-1 Copper plating defects
4-1-1 Caused by foreign objects(Copper plating defects)
4-1-1-1 Rough copper electrodeposit
4-1-1-2 Copper deposit on paste
4-1-1-3 Plated copper blistering
4-1-1-4 Weed-like deposit of copper
4-1-1-5 Anomaly in direct copper plating
4-1-1-6 Copper plating nodule
4-1-2 Caused by improper plating condition(copper plating defects)
4-1-2-1 Abnormal thickness of plated copper
4-1-2-2 Poor peel strength of plated copper
4-1-2-3 Burned copper deposit
4-1-2-4 Copper plating void
4-1-2-5 Insufficient throwing power
4-2 Gold plating defects
4-2-1 Caused by foreign objects(gold plating defects)
4-2-1-1 No gold deposit
4-2-1-2 Discoloured gold deposit
4-2-1-3 Blistered gold deposit
4-2-1-4 Peeled gold deposit
4-2-1-5 Pinhole in gold deposit
4-2-1-6 Abnormal gold deposition
4-2-1-7 Scratch on gold deposit
4-2-1-8 Stain residue on gold deposit
4-2-1-9 Foreign object on gold edge board contact
4-2-1-10 Dent on gold plated edge board contact
4-2-2 Caused by improper plating condition(gold plating defects)
4-2-2-1 Gold particle scattered on solder resist
4-2-2-2 Improper gold deposit thickness
4-2-2-3 Wrong type of gold plating
4-2-3 Caused by defective basis metal
4-2-3-1 Dent on gold plating basis metal
4-2-3-2 Pit on gold deposit caused by laminate defect
4-2-3-3 Pit on gold deposit caused by degraded base copper
4-2-3-4 Pit on gold deposit caused by base copper defect
4-2-3-5 Pit on gold deposit caused by base nickel defect
4-2-3-6 Gold plating pit on corroded Ni basis
4-2-4 Others(gold plating defects)
4-2-4-1 Trace of drilled hole on gold edge board contact
4-2-4-2 Gold deposit on unnecessary area
4-3 Solder coating (HAL) defects
4-3-1 Caused by improper solder composition.
4-3-1-1 Excessive solder mound
4-3-1-2 Poor solder luster
4-3-1-3 Poor solder wetting by improper solder composition
4-3-1-4 Solder bridge by improper solder composition
4-3-2 Others(solder coating (HAL) defects)
4-3-2-1 Entrapped foreign object in solder
4-3-2-2 Solder plugged hole
4-3-2-3 Scratch made in HAL
4-3-2-4 Uneven solder thickness
4-3-2-5 Adhered solder
4-3-2-6 Solder ball adhesion
4-3-2-7 Poor solder wetting by foreign material
4-3-2-8 No solder on terminal
4-3-2-9 Too small solder coated hole
4-3-2-10 Solder resist debris from between terminals entrapped in solder
5 PTH defects
5-1 Copper PTH defects (excluding PTH open)
5-1-1 Caused by improper hole quality
5-1-1-1 Nail head
5-1-1-2 Burr in PTH
5-1-1-3 Glass fiber protrusion in PTH
5-1-1-4 Rough hole wall
5-1-1-5 Resin smear in PTH
5-1-2 Others(copper PTH defects (excluding PTH open))
5-1-2-1 PTH hole clogging with foreign object
5-1-2-2 Plating void in PTH
5-1-2-3 Nodule on PTH wall
5-1-2-4 Etchback-shaped PTH sidewall
5-1-2-5 Negative-etchback-shaped PTH side wall
5-1-2-6 Hole fragment
5-1-2-7 Missing Hole wall conductor of PTH
5-1-2-8 Raised copper deposit at PTH hole edge
5-1-2-9 Wicking
5-1-2-10 Damaged PTH corner
5-2 Silver-paste through-hole defects
5-2-1 Insufficient silver paste filling
5-2-2 Excessive silver paste thickness at hole neck
5-2-3 Displaced overcoat silver of through hole
5-2-4 Splash of silver paste
5-2-5 Excessive silver paste filling
5-2-6 Blurred silver paste
5-2-7 Foreign object entrapped in silver paste
5-2-8 Chipped silver through hole overcoat
5-2-9 Missing silver-paste through hole
5-2-10 Void in silver-paste through hole
6 Machining defects
6-1 Punching defect
6-1-1 Dent in punching
6-1-2 Cracked board by punching
6-1-3 Hair crack in nickel/gold deposit
6-1-4 Board cracking by push back processs
6-1-5 Misalignment in punching
6-1-6 Cracking along perforation
6-1-7 Detached push back board
6-1-8 Chipped board by punching
6-1-9 Burr by punching
6-1-10 Haloing
6-1-11 Cracked edge board by punching
6-2 V-grooving defect
6-2-1 V groove misalignment between front and back sides
6-2-2 Displaced V groove position
6-2-3 Improper residual laminate thickness in V-grooving (Improper throat thickness)
6-2-4 Improper V groove angle
6-2-5 V-grooving failure
6-2-6 Excessive number of V grooves
6-2-7 Cracked V-groove
6-2-8 Difficulty in breaking out at a V groove
6-2-9 A displaced corner in crossed V grooves
6-2-10 Burr in V groove
6-2-11 Exposed copper by V-grooving
6-2-12 Fall-off of cantilever outside of V groove
6-3 Defects in machining slits, slots and perforations
6-3-1 Machining process omitted
6-3-1-1 Omitted slitting process
6-3-1-2 Omitted slotting process
6-3-1-3 Omitted perforation process
6-3-2 Bad machining
6-3-2-1 Wrong slit or slot width
6-3-2-2 Wrong hole size
6-3-2-3 Wrong machining length
6-3-2-4 Wrong number of holes
6-3-2-5 Wrong hole position
6-3-2-6 Extra hole
6-3-2-7 Defective slot outlining
6-3-2-8 Defective hole shape
6-3-2-9 Burr on FPC non-plated through hole by punching
6-4 Others(machining defects)
6-4-1 Defective counterbore
6-4-2 Displaced hole position
6-4-3 Leaned hole
6-4-4 Un-penetrated hole by broken drill bit
6-4-5 Rugged hole by drill bit deflection
6-4-6 Hole with burrs
6-4-7 Wrong chamfer angle
6-4-8 Wrong chamfer angle
6-4-9 Defective outlining
6-4-10 Haloing by routing
6-4-11 Deformed slot by damaging
6-4-12 Burr by routing
6-4-13 Separated perforation
6-4-14 Defective board fixing hole
6-4-15 Dent on oblong hole edge
6-4-16 Hair-cracked board
7 Other defects
7-1 Lamination defects
7-1-1 Layer-to-layer misalignment
7-1-2 Void in laminate
7-1-3 Dent on laminate
7-1-4 Defective resin flow in lamination
7-1-5 Foreign object between layers
7-2 Preflux (OSP) application defects
7-2-1 Uneven preflux (OSP) application
7-2-2 Tacky preflux (OSP)
7-2-3 Foreign object on preflux (OSP)
7-2-4 Wrong preflux (OSP)
7-2-5 Repelled preflux (OSP)
7-3 Laminate defects
7-3-1 Foreign object in laminate
7-3-2 Void in laminate
7-3-3 Defective resin flow in laminate
7-3-4 Delamination
7-4 Others(other defects)
7-4-1 Foreign object in carbon paste print
7-4-2 Dent by test probe
7-4-3 Strip coat residue in hole
7-4-4 Uneven oxide treatment of innerlayer of multilayer board
7-4-5 Dryfilm residue on conductor
7-4-6 Wrong board direction relative to reinforcement fabric orientation
7-4-7 Wire bonding failure
7-4-8 Hole plugged with punch debris
7-4-9 Foreign object on divided PTH terminal
7-4-10 Dirty bare-copper land
7-4-11 Paste on counterbored area
7-4-12 Dent on gold plated edge board contact
7-4-13 Dirty board by pitch from cure oven
7-4-14 Exposed conductive paste
7-4-15 Bleeding of undercoat at jumper terminal
7-4-16 Displacement in undercoat printing
7-4-17 Foreign object on conductive paste jumper
7-4-18 Insufficient underfill under conductive paste jumper
7-4-19 Drop-in of hole plugging paste
7-4-20 Copper transfer by electrostatic destruction
7-4-21 Dissolved copper conductor by leaked electrolyte of capacitor
7-4-22 Board damage making a hole
7-4-23 Wrinkled laminate copper foil
7-4-24 FPC stiffener displacement
7-4-25 FPC stiffener separation
7-4-26 Creased FPC edge contact
7-4-27 Sharp bend of FPC
7-4-28 Blistered halogen-free base material
7-4-29 Dent on FPC base material surface
7-4-30 Bubble under FPC stiffener
7-4-31 Wrinkled FPC
8 Insufficient board reliability
8-1 Blister, delamination, crack, lifting, etc.
8-1-1 Defects of base material
8-1-1-1 Delamination
8-1-1-2 Blister
8-1-1-3 Measling
8-1-1-4 Crazing
8-1-2 Defects around PTH
8-1-2-1 Lifted land of PTH
8-1-2-2 Corner crack of PTH
8-1-2-3 Foil crack in PTH
8-1-2-4 Barrel crack of PTH wall
8-1-2-5 Resin recession of PTH wall
8-2 Others
8-2-1 Insufficient dielectric strength
9 Defects in soldering
9-1 Defective soldered PTH
9-1-1 Insufficient solder filling in PTH
9-1-2 Solder only on through-hole bottom
9-1-3 Solder only on through-hole land
9-1-4 Solder joint with blow hole
10 Defective solder joints for component mounting
10-1 Defects related to component mounting
10-1-1 Lift-off
10-1-2 Lifted land
10-1-3 Shrinkage cavity
10-1-4 Multiple shrinkage cavities
10-1-5 Separation of solder from component lead
10-1-6 Separation of through-hole plating
10-1-7 Separation of solder from PTH wall
10-1-8 Deformed land
10-1-9 Dent by automatic insertion
10-1-10 Solder joint defects due to different products used
10-1-11 Solder joint defects by use of solder of different makes
10-2 Solder joint defects before and after thermal shock test
10-2-1 Solder joint defects after thermal shock testing of about 1000 heat cycles
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