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電子回路基板の品質・信頼性解析
电子电路板的品质、可靠性解析
The Defects and Causes of Electronic Circuit Boards
(Japanese-Chinese-English language Version)
著者:長谷川 堅一
中文翻译:吴 耀辉
中文审查:林 盛川、陈 汉真

英訳:小林 正、柴田 明一
Date of issue: June 2008
Price 5,250 Yen
A4 Size 355 Pages
PREFACE
This book is published in the name of “The Defects and Causes of Electronic Circuit Boards” in Japanese, together with in Chinese and English for convenience of the user of this book, editing the revised version of “The Defects and Causes of Printed Boards”. In editing the book, some modifications were made in explanation of some defects and the table of contents and the indices in Chinese and English were also added.
This book may be used for as;
1) A guidebook for novice engineers to understand the defects generated in printed boards
2) A guidebook for obtaining clues for eliminating defects in printed boards
3) A reference book to help acquire middle class workers and engineers habit to observe more closely to reduce the defects in printed boards
4) A guidebook for the management to refer to as necessary
CONTENTS

1  Conductor defects
1-1  Electrical open
1-1-1  Caused by foreign object(electrical open)
1-1-1-1  Single open by a foreign object
1-1-1-2  Multiple opens caused by a foreign object
1-1-1-3  Threadlike open
1-1-1-4  Conductor-pattern-like open
1-1-1-5  Convex open
1-1-1-6  Concave open
1-1-1-7  Needle-shaped open
1-1-1-8  An open tailing caused by a foreign object
1-1-1-9  Convex tailing open
1-1-1-10 Open caused by residual adhesive
1-1-1-11 Groove-shaped open
1-1-1-12 Multiple tailed open
1-1-1-13 Open by defective plating by an attached foreign object 
1-1-1-14 Internal layer open
1-1-2  Caused by damages to the board(Electrical open)
1-1-2-1  Deformed and broken open
1-1-2-2  Open by impact cracking
1-1-2-3  Open along scratch
1-1-2-4  Open by impact scrape
1-1-2-5  Open by damaged surface of internal base material
1-1-3  Caused by scratches(Electrical open)
1-1-3-1  Open caused by scratch on board
1-1-3-2  Open by abrasion scratch
1-1-3-3  Open by handling scratch
1-1-3-4  Open by electrostatic discharge
1-1-3-5  Opens by multiple scratches
1-1-3-6  Open by damaged base material
1-1-4  PTH opens
1-1-4-1  Open PTH by broken tenting
1-1-4-2  PTH open by etching of conductor by residual chemical
1-1-4-3  PTH open by mechanical shock
1-1-4-4  PTH open by trapped bubble
1-1-4-5  PTH open by delamination
1-1-4-6  PTH open by land break
1-1-4-7  PTH open by trapped bubble in rugged hole
1-1-4-8  PTH open by plugging of a foreign object
1-1-4-9  PTH open by resin smear on via bottom land
1-1-4-10 PTH open by circumferential resin smear
1-1-4-11 Open by absence of blind via hole
1-1-4-12 Open by  etched down blind via
1-1-4-13 Open by non-plated blind via
1-1-5  Others(Electrical open)
1-1-5-1  Open by improper hole on conductor
1-1-5-2 Open by a dislocated V groove
1-1-5-3 Open by torn-off and sticked conductor 
1-1-5-4 Open by poor dry film adhesion
1-1-5-5 Open by flexural fatigue of FPC
1-1-6  Quasi open
1-1-6-1  Quasi open by nicking
1-1-6-2 Quasi open by dissolution
1-1-6-3 Dish shaped quasi open
1-1-6-4 Quasi open by sandwiched adhesive
1-1-6-5 Quasi open by electrostatic discharge
1-1-6-6 Quasi PTH open
1-1-6-7 Quasi open by abrasion scratch
1-2  Nicks
1-2-1  Caused by foreign objects(nicks)
1-2-1-1  Isolated nick by  foreign object
1-2-1-2  Conductor nick and adjacent open by foreign object
1-2-1-3  Adjacent nicked conductors by foreign object
1-2-1-4  Tailed nick by a foreign object
1-2-1-5  Round nick by dent
1-2-1-6  Nick by residual adhesive
1-2-1-7  Dish shaped nick
1-2-1-8  Nick by adhesive sandwiching
1-2-1-9  Nick by dent on base material
1-2-1-10 Nick of edge  edge contact by a foreign object
1-2-1-11 Nick by hair
1-2-1-12 Nick by dent
1-2-1-13 Nick of Inner layer conductor
1-2-2  Resulted from other causes(nicks)
1-2-2-1  Nick by board surface damage
1-2-2-2  Nick by poor dry film adhesion
1-2-2-3  Nick by electrostatic discharge
1-2-2-4  Nick by base material dent
1-2-2-5  Nick by board damage
1-2-2-6  Chipping by stained AWF Nick by stained phototool
1-2-2-7  Hole break-out by misalignment
1-2-2-8  Rough edged conductor
1-2-2-9  Nick of fiducial mark
1-2-2-10 Etched copper of base material
1-2-2-11 Nick by tearing around large hole
1-2-2-12 Nick by tear and transfer of conductor
1-2-2-13 Nick of carbon printed pattern
1-2-2-14 Chipping by poor DFR adhesion on plugged hole Conductor nick on a plugged hole by poor 
        dry film adhesion
1-3  Pinhole
1-3-1  Caused by foreign objects(pinhole)
1-3-1-1  Pinhole
1-3-1-2  Pit
1-3-2  Others(pinhole)
1-3-2-1  Pinhole by electrostatic discharge
1-3-2-2  Pinhole by stained phototool
1-3-2-3  Pinhole by tear and transfer of conductor
1-4  Conductor width reduction
1-4-1  Caused by over etch(Conductor width reduction)
1-4-1-1  Reduced width throughout the conductor width
1-4-1-2  Locally reduced width of conductor
1-4-2  Caused by poor dry film adhesion(Conductor width reduction)
1-4-2-1  Reduced conductor width by poor dry film adhesion
1-4-3  Caused by defective phototool(Conductor width reduction)
1-4-3-1  Reduced conductor width by a defective phototool
1-5  Conductor protrusion
1-5-1  Caused by foreign objects(conductor protrusion)
1-5-1-1  Projected conductor by a defective phototool
1-5-1-2  Projected conductor by exposing light leakage
1-5-1-3  Projected conductor by scam
1-5-1-4  Projected conductor by sludge
1-5-1-5  Projected conductor by adhesive on CCL surface
1-5-1-6  Projected conductor by adhesive on plated surface
1-5-1-7  Projected conductor by prepreg debris
1-5-1-8  Outward conductor projection by adhered debris
1-5-1-9  Conductor projection by adhered debris
1-5-1-10 Rough plating
1-5-1-11 Plating nodule
1-5-1-12 Whisker
1-5-1-13 Projected conductor by debris of carrier film adhesive
1-5-1-14 Projected conductor by adhesives
1-5-2  Caused by incomplete etching
1-5-2-1  Projected conductor by improper pattern configuration
1-5-2-2  Projected conductor by etching nozzle clogging
1-5-3  Others(conductor protrusion)
1-5-3-1  Projected conductor by damaged board
1-5-3-2  Projected conductor by etching of conductor
1-5-3-3  Sliver
1-5-3-4  Projected conductor from laser drilled hole
1-5-3-5  Projected conductive paste jumper
1-5-3-6  Adhered and projected conductor
1-5-3-7  Projected conductor by through-hole burr
1-5-3-8  Granular nodule on gold plated surface
1-6  Residual copper
1-6-1  Caused by foreign objects(residual copper)
1-6-1-1  Scum or sludge-like residual copper
1-6-1-2  Residual copper under prepreg debris
1-6-1-3  Residual copper under paste adhered on laminated copper foil
1-6-1-4  Residual copper by carrier-film adhesive residue
1-6-1-5  Residual copper in laminate
1-6-1-6  Residual copper by a foreign object in laminate
1-6-2  Others(residual copper)
1-6-2-1  Residual copper by clogged etching nozzle
1-6-2-2  Residual copper on board border area
1-7  Expanded copper
1-7-1  Caused by foreign objects(expanded copper)
1-7-1-1  Expanded conductor by photographic fogging
1-7-2  Caused by irregular etching(Expanded copper)
1-7-2-1  Expanded conductor by excessive etching-conveyor speed
1-7-2-2  Expanded conductor by deteriorated etchant
1-7-3  Others(Expanded copper)
1-7-3-1  Narrow spacing between edge board contacts
1-7-3-2  Expanded conductor by photographic thermal fogging
1-8  Electrical short
1-8-1  Caused by foreign objects on the copper surface of laminate(Electrical short)
1-8-1-1  Short by adhesive foreign material
1-8-1-2  Short by tape adhesive
1-8-1-3  Short by carrier film adhesive
1-8-1-4  Short by prepreg debris
1-8-2  Caused by foreign adhesive objects on plated surface(Electrical short)
1-8-2-1  Short by dry film scum
1-8-2-2  Short by sludge
1-8-2-3  Short by adhered adhesive
1-8-3  Caused by photographic fogging
1-8-3-1  Short by a foreign object under a phototool
1-8-3-2  Short by bubble under phototool
1-8-3-3  Short by photographic fogging on rough plating
1-8-3-4  Short by poor phototool contact
1-8-3-5  Short by scratch on phototool
1-8-3-6  Short by photographic fogging by an adhered fibrous object
1-8-4  Others(Electrical short)
1-8-4-1  Short by an adhered conductive foreign object
1-8-4-2  Short by a conductive foreign object within solder resist
1-8-4-3  Short by damaged conductor
1-8-4-4  Short by wicking
1-8-4-5  Migration within resin
1-8-4-6  Migration at interface
1-8-4-7  Migration along glass cloth surface (CAF = Conductive Anodic Filament)
1-8-4-8  Migration along void
1-8-4-9  Short by clogged etching nozzle
1-8-4-10 Short by solder bridge
1-8-4-11 Layer-to-layer short by a conductive foreign object
1-8-4-12 Short by narrowed conductor spacing
1-8-4-13 Conductor pattern-like short
1-8-4-14 Short by misaligned via hole
1-8-4-15 Quasi short
1-8-4-16 Quasi short by copper debris between conductor
1-8-4-17 Short between carbon paste conductors
1-8-4-18 Quasi short by misaligned via hole
1-8-4-19 Short by improper conductive pattern
1-9  Others(conductor defects)
1-9-1  Deformed conductor by board damage
1-9-2  Torn off conductor
1-9-3  Abnormal conductor pattern
2  Solder resist defects
2-1  Improper work(Solder resist defects)
2-1-1  Caused by unskilled work(Solder resist defects)
2-1-1-1  Solder resist misalignment
2-1-1-2  Phototool misalignment
2-1-1-3  Inaccurate coverlay placement
2-1-1-4  Solder resist blur
2-1-1-5  Solder resist (spread) ooze
2-1-1-6  Wrong solder resist ink
2-1-1-7  Solder resist ink drop
2-1-1-8  Air entrapped in solder resist
2-1-1-9  Entirely underdeveloped photo solder resist
2-1-1-10 Partially underdeveloped photo solder resist
2-1-1-11 Solder resist dripped in non-plated through hole
2-1-1-12 Solder resist dripped in plated through hole
2-1-1-13 Via hole clogged with solder resist
2-1-1-14 Via hole clogged partially with solder resist
2-1-1-15 Local uneven colour of solder resistcolour
2-1-1-16 Solder resist crack
2-1-2  Caused by careless mistake
2-1-2-1  Solder resist blur by ink run-out
2-1-2-2  Contact mark on solder resist
2-1-2-3  Abrasion mark on solder resist
2-1-2-4  Dent on solder resist
2-1-2-5  Dent on coverlay
2-1-2-6  Dent on solder resist on aluminum-base printed board
2-1-2-7  Peeled off solder resist on iron-base printed board
2-1-2-8  Peeled off solder resist by impact
2-1-2-9  Contact mark on iron-base printed board
2-1-2-10 Scratch on solder resist
2-1-2-11 A scratch on solder resist of FPC
2-1-2-12 Scratch on coverlay
2-1-2-13 Nick on solder resist
2-1-2-14 Scratch on solder resist by board pulling
2-1-2-15 Scratch on solder resist of iron-base board by board pulling
2-1-2-16 Drop of solder resist ink
2-1-2-17 Soils rubbed on solder resist surface
2-1-2-18 Ink drop and run on solder resist surface
2-1-2-19 Fingerprint on solder resist surface
2-1-2-20 Superfluous solder resist by screen with partially peeled emulsion
2-1-2-21 Pasty foreign object on solder resist surface
2-1-2-22 Tape left on solder resist surface
2-1-2-23 Solder resist surface contaminated with marker pen ink
2-1-2-24 Foreign objects on FPC surface
2-1-2-25 Dirty FPC surface
2-1-2-26 Dirty base material under solder resist
2-1-2-27 Pasty foreign material under solder resist
2-1-2-28 Fingerprint on base material under solder resist
2-1-2-29 Tape left under solder resist
2-1-2-30 "X" mark on the base material under solder resist
2-1-2-31 Marker pen mark on base material under solder resist
2-1-2-32 Scratch on the conductor under solder resist
2-1-2-33 Scratch on base laminate under solder resist
2-1-2-34 Discoloured copper foil under coverlay
2-1-2-35 Fingerprint on the solder resist surface
2-1-2-36 Overcured solder resist
2-1-2-37 Conductor pattern transferred on solder resist
2-1-2-38 Threadlike photo solder resist residue on edge board contact
2-1-2-39 Spotty peeling of solder resist
2-1-2-40 Ink-stained conductor under solder resist
2-2  Caused by foreign objects(solder resist defects)
2-2-1  Foreign object remained (solder resist defects)
2-2-1-1  Attached hair on solder resist
2-2-1-2  Attached fibre on solder resist
2-2-1-3  A foreign object under coverlay
2-2-1-4  Ceiling dust on solder resist
2-2-1-5  A non-metal foreign object trapped in solder resist
2-2-1-6  Small insect body on solder resist
2-2-1-7  A metallic foreign object in solder resist
2-2-1-8  Cured ink debris on solder resist
2-2-1-9  Human-originated foreign object
2-2-1-10 Peeled paint debris in solder resist
2-2-1-11 Board debris in solder resist
2-2-1-12 Dry film debris on base material under solder resist
2-2-1-13 Attached solder on solder resist area
2-2-1-14 Cratered solder resist
2-2-1-15 Adhesive material on solder resist surface
2-2-2  Marks of foreign object(solder resist defects)
2-2-2-1  Solder resist missing on iron-base printed board due to a peeled foreign object
2-2-2-2  Solder resist missing at a peeled foreign object
2-2-2-3  Photo solder resist missing caused by a foreign object
2-2-2-4  Solder resist pinhole
2-2-2-5  Solder resist missing by bubble
2-2-2-6  Blistered solder resist
2-3  Others(solder resist defects)
2-3-1  Caused by improper equipment(solder resist defects)
2-3-1-1  Peeled solder resist by tacking
2-3-1-2  Equipment contact mark on solder resist
2-3-1-3  Abrasion mark on basis metal under solder resist
2-3-1-4  Pinch mark on solder resist
2-3-1-5  Scratch on solder resist by HAL
2-3-1-6  Scratch on solder resist of the equipment
2-3-1-7  Partially uneven solder resist
2-3-1-8  Scraped solder resist on iron-base printed board
2-3-2  Others
2-3-2-1  Solder resist left on conductor to be exposed
2-3-2-2  Insufficient solder resist thickness at a conductor edge
2-3-2-3  Fine scratch on solder resist on iron-base printed board
2-3-2-4  Solder resist missing between conductors
2-3-2-5  Peeled solder resist along localy plated gold deposited boundary
2-3-2-6  No solder resist on conductor defect
2-3-2-7  Uneven solder resist surface caused by electrostatic discharge
2-3-2-8  Cut on the basis conductor under solder resist by electrostatic discharge
2-3-2-9  Photo solder resist residue after electrostatic coating
2-3-2-10 Dry film residue in an FPC hole
2-3-2-11 Bubble under FPC coverlay
2-3-2-12 Solder resist cracking in a narrow area
2-3-2-13 Whitened solder resist by insufficient ink filling
3  Symbol mark defects
3-1  Improper printing work(Symbol mark defects)
3-1-1  Caused by unskilled work(Symbol mark defects)
3-1-1-1  Blurred symbol mark
3-1-1-2  Spread symbol mark
3-1-1-3  Peeled symbol mark
3-1-1-4  Unevenly coloured symbol mark
3-1-1-5  Pinhole in symbol mark
3-1-1-6  Symbol mark over edge board contact
3-1-2  Caused by careless mistake(Symbol mark defects)
3-1-2-1  Displaced symbol mark
3-1-2-2  Rubbed symbol mark
3-1-2-3  Deformed symbol mark
3-1-2-4  Reversely printed symbol mark
3-1-2-5  Wrong coloured symbol mark
3-1-2-6  Transferred symbol mark
3-1-2-7  Soil of symbol mark ink
3-1-2-8  Partly unprinted symbol mark
3-1-2-9  Overcured symbol mark
3-1-2-10 Chipped symbol mark by screen clogging
3-2  Others(symbol mark defects)
3-2-1  Caused by foreign objects(symbol mark defects)
3-2-1-1  Peeled symbol mark
3-2-1-2  Soil by symbol mark ink
3-2-1-3  Chipped symbol mark by a detached foreign object
3-2-1-4  Dirty symbol mark surface
3-2-1-5  Exposed copper in peeled symbol mark print
3-2-2  Others(symbol mark defects)
3-2-2-1  Symbol mark ink filled hole
3-2-2-2  Splashed symbol mark ink by electrostatic charge
3-2-2-3  Symbol mark blister
4  Plating defects
4-1  Copper plating defects
4-1-1  Caused by foreign objects(Copper plating defects)
4-1-1-1  Rough copper electrodeposit
4-1-1-2  Copper deposit on paste
4-1-1-3  Plated copper blistering
4-1-1-4  Weed-like deposit of copper
4-1-1-5  Anomaly in direct copper plating
4-1-1-6  Copper plating nodule
4-1-2  Caused by improper plating condition(copper plating defects)
4-1-2-1  Abnormal thickness of plated copper
4-1-2-2  Poor peel strength of plated copper
4-1-2-3  Burned copper deposit
4-1-2-4  Copper plating void
4-1-2-5  Insufficient throwing power
4-2  Gold plating defects
4-2-1  Caused by foreign objects(gold plating defects)
4-2-1-1  No gold deposit
4-2-1-2  Discoloured gold deposit
4-2-1-3  Blistered gold deposit
4-2-1-4  Peeled gold deposit
4-2-1-5  Pinhole in gold deposit
4-2-1-6  Abnormal gold deposition
4-2-1-7  Scratch on gold deposit
4-2-1-8  Stain residue on gold deposit
4-2-1-9  Foreign object on gold edge board contact
4-2-1-10 Dent on gold plated edge board contact
4-2-2  Caused by improper plating condition(gold plating defects)
4-2-2-1  Gold particle scattered on solder resist
4-2-2-2  Improper gold deposit thickness
4-2-2-3  Wrong type of gold plating
4-2-3  Caused by defective basis metal
4-2-3-1  Dent on gold plating basis metal
4-2-3-2  Pit on gold deposit caused by laminate defect
4-2-3-3  Pit on gold deposit caused by degraded base copper
4-2-3-4  Pit on gold deposit caused by base copper defect
4-2-3-5  Pit on gold deposit caused by base nickel defect
4-2-3-6  Gold plating pit on corroded Ni basis
4-2-4  Others(gold plating defects)
4-2-4-1  Trace of drilled hole on gold edge board contact
4-2-4-2  Gold deposit on unnecessary area
4-3  Solder coating (HAL) defects
4-3-1  Caused by improper solder composition.
4-3-1-1  Excessive solder mound
4-3-1-2  Poor solder luster
4-3-1-3  Poor solder wetting by improper solder composition
4-3-1-4  Solder bridge by improper solder composition
4-3-2  Others(solder coating (HAL) defects)
4-3-2-1  Entrapped foreign object in solder
4-3-2-2  Solder plugged hole
4-3-2-3  Scratch made in HAL
4-3-2-4  Uneven solder thickness
4-3-2-5  Adhered solder
4-3-2-6  Solder ball adhesion
4-3-2-7  Poor solder wetting by foreign material
4-3-2-8  No solder on terminal
4-3-2-9  Too small solder coated hole
4-3-2-10 Solder resist debris from between terminals entrapped in solder
5  PTH defects
5-1  Copper PTH defects (excluding PTH open)
5-1-1  Caused by improper hole quality
5-1-1-1  Nail head
5-1-1-2  Burr in PTH
5-1-1-3  Glass fiber protrusion in PTH
5-1-1-4  Rough hole wall
5-1-1-5  Resin smear in PTH
5-1-2  Others(copper PTH defects (excluding PTH open))
5-1-2-1  PTH hole clogging with foreign object
5-1-2-2  Plating void in PTH
5-1-2-3  Nodule on PTH wall
5-1-2-4  Etchback-shaped PTH sidewall
5-1-2-5  Negative-etchback-shaped PTH side wall
5-1-2-6  Hole fragment
5-1-2-7  Missing Hole wall conductor of PTH
5-1-2-8  Raised copper deposit at PTH hole edge
5-1-2-9  Wicking
5-1-2-10 Damaged PTH corner
5-2  Silver-paste through-hole defects
5-2-1  Insufficient silver paste filling
5-2-2  Excessive silver paste thickness at hole neck
5-2-3  Displaced overcoat silver of through hole
5-2-4  Splash of silver paste
5-2-5  Excessive silver paste filling
5-2-6  Blurred silver paste
5-2-7  Foreign object entrapped in silver paste
5-2-8  Chipped silver through hole overcoat
5-2-9  Missing silver-paste through hole
5-2-10 Void in silver-paste through hole
6  Machining defects
6-1  Punching defect
6-1-1  Dent in punching
6-1-2  Cracked board by punching
6-1-3  Hair crack in nickel/gold deposit
6-1-4  Board cracking by push back processs
6-1-5  Misalignment in punching
6-1-6  Cracking along perforation
6-1-7  Detached push back board
6-1-8  Chipped board by punching
6-1-9  Burr by punching
6-1-10 Haloing
6-1-11 Cracked edge board by punching
6-2  V-grooving defect
6-2-1  V groove misalignment between front and back sides
6-2-2  Displaced V groove position
6-2-3  Improper residual laminate thickness in V-grooving (Improper throat thickness)
6-2-4  Improper V groove angle
6-2-5  V-grooving failure
6-2-6  Excessive number of V grooves
6-2-7  Cracked V-groove
6-2-8  Difficulty in breaking out at a V groove
6-2-9  A displaced corner in crossed V grooves
6-2-10 Burr in V groove
6-2-11 Exposed copper by V-grooving
6-2-12 Fall-off of cantilever outside of V groove
6-3  Defects in machining slits, slots and perforations
6-3-1  Machining process omitted
6-3-1-1  Omitted slitting process
6-3-1-2  Omitted slotting process
6-3-1-3  Omitted perforation process
6-3-2  Bad machining
6-3-2-1  Wrong slit or slot width
6-3-2-2  Wrong hole size
6-3-2-3  Wrong machining length
6-3-2-4  Wrong number of holes
6-3-2-5  Wrong hole position
6-3-2-6  Extra hole
6-3-2-7  Defective slot outlining
6-3-2-8  Defective hole shape
6-3-2-9  Burr on FPC non-plated through hole by punching
6-4  Others(machining defects)
6-4-1  Defective counterbore
6-4-2  Displaced hole position
6-4-3  Leaned hole
6-4-4  Un-penetrated hole by broken drill bit
6-4-5  Rugged hole by drill bit deflection
6-4-6  Hole with burrs
6-4-7  Wrong chamfer angle
6-4-8  Wrong chamfer angle
6-4-9  Defective outlining
6-4-10 Haloing by routing
6-4-11 Deformed slot by damaging
6-4-12 Burr by routing
6-4-13 Separated perforation
6-4-14 Defective board fixing hole
6-4-15 Dent on oblong hole edge
6-4-16 Hair-cracked board
7  Other defects
7-1  Lamination defects
7-1-1  Layer-to-layer misalignment
7-1-2  Void in laminate
7-1-3  Dent on laminate
7-1-4  Defective resin flow in lamination
7-1-5  Foreign object between layers
7-2  Preflux (OSP) application defects
7-2-1  Uneven preflux (OSP) application
7-2-2  Tacky preflux (OSP)
7-2-3  Foreign object on preflux (OSP)
7-2-4  Wrong preflux (OSP)
7-2-5  Repelled preflux (OSP)
7-3  Laminate defects
7-3-1  Foreign object in laminate
7-3-2  Void in laminate
7-3-3  Defective resin flow in laminate
7-3-4  Delamination
7-4  Others(other defects)
7-4-1  Foreign object in carbon paste print
7-4-2  Dent by test probe
7-4-3  Strip coat residue in hole
7-4-4  Uneven oxide treatment of innerlayer of multilayer board
7-4-5  Dryfilm residue on conductor
7-4-6  Wrong board direction relative to reinforcement fabric orientation
7-4-7  Wire bonding failure
7-4-8  Hole plugged with punch debris
7-4-9  Foreign object on divided PTH terminal
7-4-10 Dirty bare-copper land
7-4-11 Paste on counterbored area
7-4-12 Dent on gold plated edge board contact
7-4-13 Dirty board  by pitch from cure oven
7-4-14 Exposed conductive paste
7-4-15 Bleeding of undercoat at jumper terminal
7-4-16 Displacement in undercoat printing
7-4-17 Foreign object on conductive paste jumper
7-4-18 Insufficient underfill under conductive paste jumper
7-4-19 Drop-in of hole plugging paste
7-4-20 Copper transfer by electrostatic destruction
7-4-21 Dissolved copper conductor by leaked electrolyte of capacitor
7-4-22 Board damage making a hole
7-4-23 Wrinkled laminate copper foil
7-4-24 FPC stiffener displacement
7-4-25 FPC stiffener separation
7-4-26 Creased FPC edge contact
7-4-27 Sharp bend of FPC
7-4-28 Blistered halogen-free base material
7-4-29 Dent on FPC base material surface
7-4-30 Bubble under FPC stiffener
7-4-31 Wrinkled FPC
8  Insufficient board reliability
8-1  Blister, delamination, crack, lifting, etc.
8-1-1  Defects of base material
8-1-1-1  Delamination
8-1-1-2  Blister
8-1-1-3  Measling
8-1-1-4  Crazing
8-1-2  Defects around PTH
8-1-2-1  Lifted land of PTH
8-1-2-2  Corner crack of PTH
8-1-2-3  Foil crack in PTH
8-1-2-4  Barrel crack of PTH wall
8-1-2-5  Resin recession of PTH wall
8-2  Others
8-2-1  Insufficient dielectric strength
9  Defects in soldering
9-1  Defective soldered PTH
9-1-1  Insufficient solder filling in PTH
9-1-2  Solder only on through-hole bottom
9-1-3  Solder only on through-hole land
9-1-4  Solder joint with blow hole
10  Defective solder joints for component mounting
10-1  Defects related to component mounting
10-1-1  Lift-off
10-1-2  Lifted land
10-1-3  Shrinkage cavity
10-1-4  Multiple shrinkage cavities
10-1-5  Separation of solder from component lead
10-1-6  Separation of through-hole plating
10-1-7  Separation of solder from PTH wall
10-1-8  Deformed land
10-1-9  Dent by automatic insertion
10-1-10 Solder joint defects due to different products used
10-1-11 Solder joint defects by use of solder of different makes
10-2  Solder joint defects before and after thermal shock test
10-2-1  Solder joint defects after thermal shock testing of about 1000 heat cycles
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JPCA-Japan Electronics Packaging and Circuits Association