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Order Sheet for the JPCA's Publications
 
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Title @ Price Quantity
電子回路基板の品質・信頼性解析 电子电路板的品质、可靠性解析
The Defects and Causes of Electronic Circuit Boards
(Japanese-Chinese-English language Version) 		JY 5,250  
PURINTOBAN-JYUKU Introduction to the Printed wiring board Technology JY 2,100  
PURINTOBAN-JYUKU IV Introduction to Buid-up Printed Wiring board JY 2,100  
PURINTOBAN-JYUKU V Introduction to Jisso (Packaging) Technology JY 2,100  
PURINTOBAN-JYUKU VII Introduction to Flexible Printed Wiring Board Technology JY 2,100  
PURINTOBAN-JYUKU VIII Basic of Printed Wiring Board Technology for Non-Japanese Technicians JY 2,100  
Performance Guide for Single-and Double-sided Flexible Printed Wiring Boards JPCA-DG02-2006 JY 2,100  
Standard on Device Embedded Substrate Terminology / Reliability Test / Design Guide - Edition 4 - JPCA-EB01-2011 JY 12,600  
Standard on Device Embedded Substrate Data Fortmat - Edition 1 - JPCA-EB02-2011 JY 5,250  
Test Method for Halogen-Free Materials JPCA-ES01-2003 JY 2,100  
Phenol collection method for copper-clad laminete - JPCA-ES07-2007 JY 1,050  
A test method for copper-clad laminates for printed wiring boards dielectric constant and dissipation factor - JPCA-TM001-2007 JY 2,100  
Halogen-free copper-clad laminates for printed wiring boards - JPCA-ES02-2007
JPCA-ES03-2007 JPCA-ES04-2007 JPCA-ES05-2007 JPCA-ES06-2007		 JY 3,150  
Copper-clad laminates for printed wiring boards - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity and　flammability (vertical burning test), copper-clad JPCA-HCL01-2009 JPCA-HCL02-2009
Copper-clad laminates for printed wiring boards - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity and　flammability (vertical burning test), copper-clad JPCA-HCL21-2009 JPCA-HCL22-2009 		JY 3,150  
Copper-Clad Laminate for Flexible Printed Wiring Boards (Adhesive and Non-adhesive types) - JPCA-BM03/CFIA-0006-2006 JY 2,100  
Drill-bit-cassette and Router-bit-cassette for Printed Wiring Board processing JPCA-ME-DC01-2002 JY 2,100  
General rules of Optical Boards JPCA-PE02S-2003 JY 2,100  
Detail Specification for Optical Board Connector type SF using glass Fibers JPCA-PE03-01-01S-2003 JY 2,100  
Detail Specification for Optical Board Connector type MF using glass Fibers JPCA-PE03-01-04S-2003 JY 2,100  
Generic rules for Optoelectronic Modules JPCA-PE04S-2004
Generic Specification for OE-Module Substrates JPCA-PE04-02-01S-2004
Generic Specification for Packaging Interface of OE-Modules JPCA-PE04-02-01S-2004		 JY 2,100  
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JPCA-Japan Electronics Packaging and Circuits Association