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Preface by the Author |
This book is acompilation of a series of articles
published in the JPCA News for a period between Apri1, 1996 and March, 1997
with the title of "Prep School to PWB-An Introduction to Printed Wiring Boards
Technology for Novice Engineers".
There were voices of young engineers addressed to
the JPCA that a good introductory book to the printed wiring board technology
for novice engineers was hard to be found. There were books for experts with
fu1l of jargons of technical terms, and it was hard to understand the actual
process of manufacturing printed wiring boards. This was the start of this
series of lectures to provide young engineers with the basics of the printed
wiring board technology starting with ABC of thetechnology. The book was
welcomed not only to those new in the technology but also for people who had
been working in production lines but did not have chances to obtain
comprehensive knowledge of the technology, and those non-experts working in
marketing or in administration areas. The users of printed wiring boards also
make use of this book.
The production automation has been around for many
years for printed wiring board manuhcturing. And yet the quality of the
products still depends on the skill, and the understanding of the process of
workers in the lines to a great extent. I believe that deep understanding of
the printed wiring board manufacturing by the workers and by those indirectly
invoIved in the production is the key to produce products with high and stable
quality, and also to the development of new products of the next generation.
It is my sincere wish that this book can be of value for the enlightenment of
people invoIved in this technology. It should be stated that this book is only
for the introduction to the printed wiring board technology. Advanced and
detailed information of the technology can only be attained by studying
relevant text books and articles in professional journals, and from the latest
technical/product information appearing in various periodicals.
This book is intended to answer to their simple
questions but also to give technical background to the people who are not
directly invoIved in the technology, people working in areas of business
negotiations, Office workers or procurement in board manufacturers and also in
set producers. We believe this book provide to the people interested in
advanced electronic equipment with broad information in a wide range of
printed circuit board technology.
I sincerely thank Dr. A. Shibata of JPCA for the
translation of this
valuable book.
December, 2000
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Tadashi Kobayashi
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Contents |
1. Printed wiring boards(PWB)
1-1 Semiconductor devices-mere pebbles without printed wiringboard
1-2 Production of electronic equipment integrated circuits and printed wiring boards
1-3 Present and future of printed wiring board industry
2. Fundamental technologies and types of printed wiring boards
2-1 Formation of conductor patterns(Etching)
2-2 Formation of vias
2-3 Multilayer printed wiring board(Lamination)
2-4 Types of printed wiring boards and their usage
2-5 New types of printed wiring boards
3. Materials
3-1 Structure of copper-clad laminate
3-2 Fabrication process of copper-clad laminates
3-3 Specifications
4. Fabrication of printed wiring board(PWB)
4-1 Solder resist, symbolmark, terminal plating
4-1-1 Solder resist
4-1-2 Printing of symbol marks
4-1-3 Plating of edge-board contacts
4-2 Panels
4-3 Fabrication of single-sided printed wiring boards
4-4 Fabrication of double-sided boards
4-5 Fabrication of multilayer boards
5. Elements of technology
5-1 Formation of conductor pattern
5-1-1 Patterns, positive and negative
5-1-2 Formation of conductor pattern
5-1-3 Formation ofresist pattern
5-1-4 Etching
5-2 Interconnection between layers(formation of vias)
5-2-1 Types of vias(through vias, blind bias and buried vias)
5-2-2 Land, 1and width and hole break-out(or land break-out)
5-2-3 Via sizes and interconnection density of a board
5-2-4 Formation of via holes
5-2-5 Conductive coating of the via wall
5-3 Piling up layers(lamination)
5-3-1 Curing of prepregs and interlayer adhesion
5-3-2 1aminator
5-3-3 Design of phototool(pattern layout)
5-4 Printing of solder resist and symbolmafks
5-4-1 Solder resist
5-4-2 Symbol mark(legend)
5-5 Plating in general and edge-board contact plating
5-5-1 Faraday's law
5-5-2 Principle of electroless plating
5-5-3 Types and applications of plating
5-5-4 Edge-board contact plating
5-6 Blanking and other mechanical machining
5-6-2 Cutting raw base material and making chamfers
5-6-3 Registration and tooling holes
5-7 Surhce treatment and surface finish
5-7-1 Surface treatment
5-7-2 Scrubbing, Cleanlng and pre-treatment
5-7-3 Surface finish
5-7-4 Handling
6. Inspection and testing
6-1 Required quality of printed wiring boards
6-2 Test and inspection methods of printed boards
6-2-1 Continuity and insulation testing
6-2-2 Visual inspection
6-2-3 Dimensional inspection
6-2-4 Plated-through hole
6-2-5 Solderability and soldering heat resistance
6-2-6 Environmental tests
6-3 Detection of deftcts and cost for repair
7. Deslgn and tooI preparation
7-1 Development work of a set and design of printed boards
7-2 Set design
7-2-1 Mechanical design
7-2-2 Circuit design
7-3 Design of printed boards
7-3-1 Design rule
7-3-2 Layout of components
7-3-3 Design of wiring pattern
7-4 Preparation of jigs, tools and processing data
7-4-1 Phototool and its plotting
7-4-2 Data for drilling and blanking
7-4-3 Die for punching
7-4-4 Test fixture and test data
7-4-5 Specification of the production
7-5 Quality of design
8. Assembly
8-1 Assembly
8-2 Components
8-3 Soldering
8-4 Assembly process
8-5 Quality of packaging and inspection
9. Printed wlnng boards in the future
9-1 Electronics and packaging technology in the 21st century
9-2 Varieties of conventional and new production processes
9-2-1 Cost reduction
9-2-2 Fine pattern of wiring
9-2-3 Reduction of the number and size of holes(lands)
9-2-4 Multilayer boards
9-3 Packaging in future and its technology
9-4 The printed wiring board industry in the 21st century
10. Terms and standards for printed wiring boards
10-1 Terms for printed wiring boards
10-2 Standards and specifications
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