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JPCA Standard
Halogen-free copper-clad laminates for printed wiring boards
- Paper base, phenolic resin
JPCA-ES02-2007
Halogen-free copper-clad laminates for printed wiring boards
- Glass cloth surfaces, nonwoven glass core, epoxy resin
JPCA-ES03-2007
Halogen-free copper-clad laminates for printed wiring boards
- Glass fabric base, epoxy resin
JPCA-ES04-2007
Halogen-free copper-clad laminates for multilayer printed wiring boards
- Glass fabric base, epoxy resin
JPCA-ES05-2007
Halogen-free prepreg for multilayer printed wiring boards
- Epoxy resin-impregnated glass cloth
JPCA-ES06-2007
Date of issue: Mar 25, 2007
Price 3,150 Yen
A4 Size 90 Pages
Halogen-free copper-clad laminates for printed wiring boards
- Paper base, phenolic resin
JPCA-ES02-2007

CONTENTS
1. General
 1.1 Scope  1.2 Halogen-free laminates
2. Terms and Definitions
3. Grade of Copper-Clad Laminates
4 Dimensions
 4.1 Thickness of Copper Foil
 4.2 Size
 4.3 Thickness
 4.4 Tolerance of thickness
5. Appearance
6. Flammability
7. Characteristics and Test Methods
8. Packaging and Identification

Halogen-free copper-clad laminates for printed wiring boards
- Glass cloth surfaces, nonwoven glass core, epoxy resin
JPCA-ES03-2007

CONTENTS
1. General
 1.1 Scope
 1.2 Halogen-free laminates
2. Terms and Definitions
3. Grade of Copper-Clad Laminates
4 Dimensions
 4.1 Thickness of Copper Foil
 4.2 Size
 4.3 Thickness
 4.4 Tolerance of thickness
5. Appearance
6. Flammability
7. Characteristics and Test Methods
8. Packaging and Identification

Halogen-free copper-clad laminates for printed wiring boards
- Glass fabric base, epoxy resin
JPCA-ES04-2007

CONTENTS
1. General
 1.1 Scope
 1.2 Halogen-free laminates
2. Terms and Definitions
3. Grade of Copper-Clad Laminates
4 Dimensions
 4.1 Thickness of Copper Foil
 4.2 Size
 4.3 Thickness
 4.4 Tolerance of thickness
5. Appearance
6. Flammability
7. Characteristics and Test Methods
8. Packaging and Identification

Halogen-free copper-clad laminates for multilayer printed wiring boards
- Glass fabric base, epoxy resin
JPCA-ES05-2007

CONTENTS
1. General
 1.1 Scope
 1.2 Halogen-free laminates
2. Terms and Definitions
3. Grade of Copper-Clad Laminates
4 Dimensions
 4.1 Thickness of Copper Foil
 4.2 Size
 4.3 Thickness
 4.4 Tolerance of thickness
5. Appearance
6. Flammability
7. Characteristics and Test Methods
8. Packaging and Identification

Halogen-free prepreg for multilayer printed wiring boards
- Epoxy resin-impregnated glass cloth
JPCA-ES06-2007

CONTENTS
1. General
 1.1 Scope
 1.2 Halogen-free prepregs
2. Terms and Definitions
3. Grade of prepregs
4. Specifications
 4.1 Resins
 4.2 Flow of resin
 4.3 Volatile components
 4.4 Curing time
 4.5 Flammability
 4.6 Electrical characteristics
5. Appearance and Dimensions
 5.1 Appearance
 5.2 Size
  5.2.1 Length and width
  5.2.2 Thickness of prepregs after formation of prepregs
  5.2.3 Rectangularity
6. Materials  6.1 Epoxy resin
 6.2 Glass cloth
7. Test methods
8. Warranty
9. Packaging and Identification
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JPCA-Japan Electronics Packaging and Circuits Association