1. Scope
2. Normative reference
3. Terms and definitions
4. Test Methods
5. Performance Levels
6. Base materials
7. Visual Inspection
 7.1 Test environment
 7.2 Test specimens
 7.3 Tools for testing
 7.4 Preparation of limit samples
 7.5 Description of inspections
  7.5.1 Visual inspection of conductors
   7.5.1.1 Open and short circuits
   7.5.1.2 Nicks and pinholes on conductors
   7.5.1.3 Extraneous copper between conductors/spurs and nodules of conductor
   7.5.1.4 Extraneous copper between conductors/spurs and nodules of conductor in an open area
   7.5.1.5 Etched concave surface on the conductor
   7.5.1.6 Conductor delamination
   7.5.1.7 Conductor cracks
   7.5.1.8 Scratches on conductor
   7.5.1.9 Discoloration
  7.5.2 Visual inspection of coverlay and covercoat
   7.5.2.1 Void
   7.5.2.2 Foreign matters
   7.5.2.3 Blistering and delamination
   7.5.2.4 Squeeze-out of adhesive of coverlay, ooze-out of covercoat and photosensitive
          register strike
   7.5.2.5 Skipping of covercoat photosensitive register strike
  7.5.3 Visual inspection of plating
   7.5.3.1 Plating defects
    7.5.3.1.1 Gold plating
    7.5.3.1.2 Solder plating (Solder paste or dip solder including use of lead free solder)
   7.5.3.2 Penetration of plated metal or solder (Solder paste or dip solder including use of
          lead free solder)
   7.5.3.3 Surface condition of plated metal and solder
    7.5.3.3.1 Gold plating
    7.5.3.3.2 Solder plating (Solder paste or dip solder including use of lead free solder)
    7.5.3.3.3 Plating voids in plated through hole
  7.5.4 Visual inspection of edges of outline and holes
   7.5.4.1 Tears and nicks
   7.5.4.2 Burrs
   7.5.4.3 Thready burrs
  7.5.5 Visual imperfections related to stiffener bonding
   7.5.5.1 Foreign matter between flexible printed board and stiffener
   7.5.5.2 Voids between flexible printed board and stiffener
   7.5.5.3 Defects of stiffener
    7.5.5.3.1 Cracks
    7.5.5.3.2 Chip-off
    7.5.5.3.3 Scratches
    7.5.5.3.4 Bow and twist
  7.5.6 Other visual inspection
   7.5.6.1 Fixed substances on surface（Excluding the area of exposed conductor）
    7.5.6.1.1 Thermosetting adhesive
    7.5.6.1.2 Flux residues
    7.5.6.1.3 Residue of metal powders (Solder, Aluminum, Copper, etc.)
    7.5.6.1.4 Residue of adhesive
   7.5.6.2 Protrusion and dents
   7.5.6.3 Bow and twist
   7.5.6.4 Conductor
   7.5.6.5 Base Film Side
   7.5.6.6 Visual inspection of coverlay and covercoat
   7.5.6.7 Marking
8. Dimensional Inspections
 8.1 Measurement of dimensions
 8.2 External dimensions
 8.3 Thickness
 8.4 Hole diameter
 8.5 Conductor widths
 8.6 Cumlative pattern pitch
 8.7 Distance between hole centers
 8.8 Design minimum distance between board edges and conductors
 8.9 Positional accuracy
  8.9.1 Positional accuracy of holes
  8.9.2 Registration of hole to land
  8.9.3 Registration of coverlay (or covercoat) to a land
  8.9.4 Registration of stiffener to FPC
   8.9.4.1 Registration of holes
   8.9.4.2 The displacement between outlines of the stiffener and the FPC
  8.9.5 Registration of punched outline to conductor patterns
 8.10 Registration of pressure sensitive or heat activated adhesives (Including adhesive squeeze-out)
    to flexible printed board and stiffener
 8.11 Plating thickness of copper plated-through holes
9. Electrical performance test
 9.1  Conductor resistance
 9.2  Insulation resistance of suface layers
 9.3  Dielectric withstanding voltage of surface layers
 9.4  Open circuit between conductors
 9.5  Short circuit between conductors
10. Mechanical performance test
 10.1  Peel strength
 10.2  Pull-out strength for plain hole and footprint
 10.3  Plating adhesion
 10.4  Solderability
 10.5  Flexural endurance
 10.6  Bending resistance
11. Environmental performance
 11.1  Temperature cycling
 11.2  Humidity test
 11.3  Thermal shock
 11.4  Thermal shock resistance of connection between layers (copper plated-through hole, etc.)
 11.5  Migration
 11.6  Whisker
12. Chemical resistance
13. Cleanliness
14. Flame resistance
15. Marking, packaging, and storage  These should normally be agreed upon betwee
 15.1  Marking on products
 15.2  Marking on package
 15.3  Packaging and storage
  15.3.1 Packaging
  15.3.2 Storage
  15.3.3 Handling

Appendix I  Example of Handling Instruction Manual Handling of Polyimide-Based FPC
1. Storage and handling
2. Component mounting and installation to equipment
3. Soldering
 3.1  Pre-Treatment
 3.2  Soldering
4. Disposal
5. The adoption and the switchover of lead-free plating
Appendix II  Ion Migration test
Appendix III  Whisker test

Additional Information
Explanation on JPCA Performance Guide for Single- and Double-sided Flexible Printed Wiring Boards