1. Scope:  This standard specifies the properties of copper-clad laminates used for flexible boards 
for both adhesive and non-adhesive types.

1.1  Normative references

2. Terms and definitions:

3. Designation of copper-clad laminates:
 3.1  Copper-clad laminate:
 3.2  Base materials:
 3.3  Thickness of the base material:
 3.4  Types of adhesives:
 3.5  Thickness of base materials and of adhesives:
 3.6  Type of copper foil:
 3.7  Grade of copper foil:
 3.8  Copper foil thickness:
 3.9  Types of profiles:
 3.10  Surface treatment to increase copper adhesivity and anti-rust:
 3.11  Symbol for flammability:

4.  Observation
 4.1  Base film:
 4.2  Copper foil:
 4.3  CCL:

5.  Size
 5.1  Base film
  5.1.1  Thickness and its allowance:
 5.2  Copper foil
  5.2.1  Thickness and its allowance:
 5.3  Adhesives
  5.3.1  Adhesives:
 5.4  CCL
  5.4.1  Thickness and its allowance
  5.4.2  Sheet dimension and its allowance:
  5.4.3  Role dimension and its allowance:

6.  Properties
 6.1  Base film:
 6.2  Copper foil:
 6.3  CCL:
7.  Package and labeling:

Copper-Clad Laminates for Flexible Boards (Adhesive and Non-adhesive types) Additional 
information

The process of developing JPCA-BM03/CFIA-0006-2003, a standard for flexible printed wiring boards 
and of revision of the first edition.

The flexible printed wiring boards (hereafter stated as flex board) are light-weighted and soft are 
expanding their application fields for smaller and lighter electronic products.  The volume of 
production of flex boards is nearly 20% of the total production of printed wiring boards.  It is 
expected the increase of the production of flex boards will continue for years to come.

The Japan Electronic Packaging and Circuits Association has organized the Standardization Committee 
for Flexible Wiring Boards in 1983 and developed numerous standards and specifications to provide 
the industry with the information required for flex boards including CCL for flex boards, a test 
method for cover-lays, assembly guide of electronic components on flex boards, and others.

The standard of CCL for flex board was first published as JPCA-BM01 in 1988 as “CCL for Flexible 
Wiring Boards (Polyester film and polyimide film).  This document was converted to a JIS as JIS C 
6472: Copper-clad laminates for flexible printed wring boards (polyester film, polyimide film) - 
(NEQ IEC 60249-2-8: 1987, 60249-2-13: 1987, 60249-2-15: 1987) and widely used in the industry. - 
NEQ: nearly equal

The use of flex boards in the industry is rapidly growing these days and the specifications have 
been extensively advanced.  In many cases, conventional “three layer structure with an adhesive 
layer” has been widely used in flex boards.  The introduction of “two-layer type” CCL which 
does not use conventional adhesive layer is a significant technical achievement in the flex board 
technology.  The two-layer type does not use adhesive layer and has superior heat resistance to 
processing and dimensional stability.  We did not have, however, clear standards for the two-layer 
type CCL, being a new introduction to the industry.  Request from the industry to set a standard 
for two-layer CCL has been appreciable in recent years.

The Standard Committee for Flexible Wiring Boards started documentation of a revised standard for 
flex board together with the support of committee members from producers of the two-layer type CCL 
in Japan.  This document includes specifications for copper foils.  We have had full support for 
the preparation of sections on copper foils.  We agreed to publish the document as a joint standard 
of JPCA and of Copper Foils Industries Association (CFIA)

The present document, JPCA-BM03/CFIA006 has a nature of a revised edition of JPCA-BM01-1998.  We 
therefore decided to disband the JPCA-BM01.
                                    (From “Additional Information” of JPCA-BM03/CFIA006, 1st Ed.)


The first edition of this document was again reviewed in the Standard Committee for Flexible Wiring 
Boards to reflect the state of the art of the present day flex boards together with the help of the 
Technical Committee of CFIA and the present JPCA-BM03/CFIA-0006-2005 was completed

The JIS document, “JIS C 6471: JIS C 6472 (1995): Copper-clad laminates for flexible printed wring 
boards (polyester film, polyimide film)” should also to be revised.  The basic principle of the 
Japanese Government is to harmonize Japan Industrial Standards to IEC and ISO standards by 
translating the documents and adopts them as Japanese standards as a relaxation of Japanese 
regulations in the industry as adopted in 1995 by the Ministry of International Trade and Industry, 
the Government organization at that time.  We should eventually revise the JIS C 6471 but the 
corresponding IEC document was published in 1987, not reflecting the latest development in the 
industry.  IEC/TC91, the Technical Committee responsible to this document is in process of revising 
the document.  We need to maintain the JIS document until the revision of corresponding IEC standards 
become available.