HOMEJPCA Standards >> The Defects and Causes of Electronic Circuit Boards << Book code No. JPCA Standard Title Standard No. date of issue Downlord S001 Test Method for Halogen-Free Materials JPCA-ES01-2003 Aug.2003 (801KB) S002 Halogen-free copper-clad laminates for printed wiring boards - Paper base, phenolic resin JPCA-ES02-2007 May 2007 (1.86MB) Halogen-free copper-clad laminates for printed wiring boards -Glass cloth surfaces, nonwoven glass core, epoxy resin JPCA-ES03-2007 Halogen-free copper-clad laminates for printed wiring boards - Glass fabric base, epoxy resin JPCA-ES04-2007 Halogen-free copper-clad laminates for multilayer printed wiring boards - Glass fabric base, epoxy resin JPCA-ES05-2007 Halogen-free preperg for multilayer printed wiring boards - Epoxy resin-impregnated glass cloth JPCA-ES06-2007 S039 Phenol collection method for copper-clad laminete JPCA-ES07-2007 May 2007 (1.95MB) S040 A test method for copper-clad laminates for printed wiring boards dielectric constant and dissipation factor (500MHz to 10GHz) JPCA-TM001-2007 May 2007 (624KB) S052 Copper-clad laminates for printed wiring boards - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1GHz) and flammability (vertical burning test), copper-clad JPCA-HCL01-2008 June 2008 (1.00MB) Copper-clad laminates for printed wiring boards - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1GHz) and flammability (vertical burning test), copper-clad JPCA-HCL21-2008 S017 Copper-Clad Laminate for Flexible Printed Wiring Boards (Adhesive and Non-adhesive types) JPCA-BM03-2006/CFIA-0006-2006 Feb. 2006 (624KB) S025E Printed Wiring Boards JPCA-PB01-2004 Oct. 2004 (2.09MB) S016E HDI Printed Wiring Boards JPCA-HD01-2003 Sep. 2004 (970KB) S012 Performance Guide for Single- and Double-sided Flexible Printed Wiring Boards JPCA-DG02-2006 May 2006 (3.40MB) S014 Drill-bit-cassette and Router-bit-cassette for Printed Wiring Board processing JPCA-ME-DC01-2002 June 2002 (617KB) S018E General rules of Optical Boards JPCA-PE02S-2003 Mat 2005 (243KB) S023E Detail Specification for Optical Board Connector type SF using glass Fibers JPCA-PE03-01-01S-2003 Mat 2005 (676KB) S027E Detail Specification for Optical Board Connector type MF using glass Fibers JPCA-PE03-01-04S-2004 Mat 2005 (797KB) S028E Generic rules for Optoelectronic Modules JPCA-PE04S-2004 Mat 2005 (554KB) Generic Specification for OE-Module Substrates JPCA-PE04-01-01S-2004 Generic Specification for Packaging Interface of OE-Modules JPCA-PE04-02-01S-2004