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| Introduction for Electronics Packaging, Design Solution and Advanced Electronic Board |
(p.m.) |
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13:00 -
13:30 |
The conditions
of a System Board Design |
Osamu
Horikoshi
Manager, System Design Group, System Design Dept.
Mentor Graphics Japan Co., Ltd. |
| Japanese |
In this session,
it talks about the improvement method of start timing and the measure method of
SI and EMC in a System Board Design. |
| Apply to |
TEL:03-5488-3035 / FAX:03-5488-3032
http://www.mentorg.co.jp/event/jpca2004/index.html |
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13:40 -
14:10 |
Signal integrity
issues of high density broad-band Circuits |
Mikio
Kiyono
Director, Engineering Division
AET Japan, Inc. |
| Japanese |
Advanced features
of MW-Studio (3D time-domain EM field solver) and it's application to the signal
integrity design will be introduced. |
| Apply to |
TEL:044-966-9981 / FAX:044-951-1572
info@aetjapan.com
http://www.aetjapan.com |
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14:20 -
14:50 |
PC Board Design
by Circuit Simulator HSPICE |
Kazuhiro
Takahashi
CAD Systems Div., Circuit Design Dept.
NTT Advanced Technology Corporation |
| Japanese |
HSPICE can simulate
high speed PC boards and ICs. An effective simulation will be shown for†signal
integrity using an accurate transmission model. |
| Apply to |
TEL:03-5325-0784 / FAX:03-5326-7845
info@cad.ntt-at.co.jp
http://www-cad.ntt-at.co.jp |
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15:00 -
15:30 |
A thermal solution
printed circuit design for high power application |
Hideki
Mizushina
Research & Development Department
Oki Printed Circuits Co., Ltd. |
| Japanese |
In the recent designs
of PCB, reduction of ΔT is becoming an important topic. Oki's R&D approach
and thermal design solution shall be presented. |
| Apply to |
TEL:0426-43-2211 / FAX:0426-43-2231
opc-sales@oki.com
http://www.oki-printed.co.jp |
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15:40 -
16:10 |
New Ways in the
High Frequency Technology |
Hibiki
Ikeda
Sales/Engineering Specialist
Ruwel AG |
| Japanese |
We will introduce
our high frequency boards used in base stations worldwide, along with other newest
technologies. |
| Apply to |
TEL:+49-0-2831-394-146 /
FAX:+49-0-2831-394-250
hibiki.ikeda@ruwel.de |
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| Highly Advanced Technology of Base Material |
(a.m.) |
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10:30 -
11:00 |
1- 5um Ultra Thin
Copper foil for HDI applications |
Harvey
P. Cheskis, Ph.D.
Olin Corporation, Somers Thin Strip/Manager, Special Products
Olin Brass Japan Inc. |
| English |
The demand for HDI
circuits is increasing to achieve advanced electronic products. In this study,
the benefits of an ultra thin foil is presented. |
| Apply to |
TEL:053-413-1500
/ FAX:053-451-0010
sales@olin.co.jp |
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11:10 -
11:40 |
Development of
Halogen Free,Low Dk & Low Df Glass/Epoxy CCL. |
Shiota
Hiroshi
Deputy manager, Chemical department of R&D division
Risho Kogyo Co., Ltd. |
| Japanese |
We have developed
the Halogen Free,Low Dk & Low Df Glass/Epoxy CCL achieved performance of flammability
which is equivalent to 94V-0. |
| Apply to |
TEL:06-6429-5727 / FAX:06-6429-6192
rd_chemical@risho.co.jp |
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11:50 -
12:20 |
Development of
excellent Heat Resistance, Excellent Reliability PCB Material |
Tamiya
Hiroki
Electronic & Plastic Materials Company,Electronic Materials Div.
Product Development Dept.
Matsushita Electric Works, Ltd. |
| Japanese |
We introduce our
newly developed materials with high degradation temp. and excellent anti-CAF property
for HLC and lead free assembly substrate. |
| Apply to |
TEL:024-944-0241 / FAX:024-944-6086
akuy@den.mew.co.jp |
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| Latest Trend of Advanced FPC Materials and FPC Process Technology |
(p.m.) |
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13:00 -
13:30 |
Seed layer remover
"FLICKER" of metallizing two-layer CCL |
Teruyoshi
Saito
R&D Laboratory
Nihon Kagaku Sangyo Co.,Ltd. |
| Japanese |
"FLICKER"
removes selectively the seed layer which remained between wiring, without attacking
Cu wiring, and realizes circuit miniaturization of FPC. |
| Apply to |
TEL:03-3876-3132 / FAX:03-3876-3278
mizunuma@nihonkagakusangyo.co.jp |
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13:40 -
14:10 |
Fatigue Life Evaluation
for Flexible Printed Circuit Using Hinge Flexibility Test and Computational Simulation |
Keiko
Kawahito
Analytical Evaluation & Reliability Technology Center
Matsushita Electric Works, Ltd. |
| Japanese |
We report the high
fatigue life of our FPC products for the cellular phone using the hinge flexibility
test and 3-dimensional elastoplastic analysis. |
| Apply to |
TEL:024-944-0241 / FAX:024-944-6086
akuy@den.mew.co.jp |
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14:20 -
14:50 |
Introduction of
Kyocera Chemical New Products for FPC Material |
Shinichi
Kazama
Sheet Materials Technical Section, Solution Chemical Materials Technical Dept.
Kyocera Chemical Corporation |
| Japanese |
KYOCERA Chemical
introduces new flexible printed circuit materials, "Super Bonding Sheet"
for the multi layer FPC and flex rigid laminates, and "Ultra Thin FPC "for
the new application. |
| Apply to |
akira.senoo@kyocera-chemi.jp |
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15:00 -
15:30 |
Production technology
by PI etching |
Takashi
Oguni
Fine Process Development Dept. Fine Process Electronics Div.
Toray Engineering Co.Ltd. |
| Japanese |
We will be exhibiting
a polyimide etching process in which the unique solution (TPE-3000) is used as
the key chemical for production technology . |
| Apply to |
TEL:03-3241-1769 / FAX:03-3271-7359 |
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| Latest Information of Highly Automated System and Cleaning Process Technology |
(a.m.) |
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10:30 -
11:00 |
Introduce "Non
Touch Transportation System" and "Plasma Equipment" |
H. Mitsui
Director & General Manager, Technical Dept.
Facility Co., Ltd. |
| Japanese |
Non Touch Transportation
System; Any roller is not used on the bottom side of PCB. Plasma Equipment; Simple
Plasma Equipment with inline system in normal temperature. |
| Apply to |
TEL:042-776-1231 / FAX:042-776-1230
facility@facility.jp |
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11:10 -
11:40 |
Innovative equipment
features for modern technology production of printed circuit boards. |
Uwe
Hauf
Business Manager, Systems
Atotech Germany GmbH |
| English |
The article describes
a newly developed conveyor system designed for the production of ultra-thin and
flexible PC boards and introduces of a newly applied design philosophy. |
| Apply to |
TEL:045-937-6152
/ FAX:045-937-6134
muranush@atotech.co.jp |
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11:50 -
12:20 |
Equipments for
cleaning Printed Circuit Board by Electrolyzed Water |
Tohru
Inayama
Kawasaki Sales Office
Hitachi Kasei Shoji Co., Ltd. |
| Japanese |
A new technology
for safeguards of the global environment; this system, using functional water
produced by electrolyzing natural water, removes an oxide film and cleans the
cupper surface on the PWBs, as well as water conservation type. |
| Apply to |
TEL:044-865-8711 / FAX:044-865-8721
kawabe@hk-shoji.co.jp |
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