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| Trends of High Density Paternning
Process Technology |
(p.m.) |
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13:00 -
13:30 |
Next generation
dryfilm for semi-additive process, Riston® JSF series (tentative
name) |
Hidetaka
Uno
Technical Representative, ATG
DuPont MRC DryFilm Ltd. |
| Japanese |
Riston® JSF
series have good performance at resolution, adhesion and stripping for semi-additive
process to pattern on substrate of high end package. |
| Apply to |
TEL:03-5434-6858 / FAX:03-5434-6915
info.dmdf@mrg.mrc.co.jp |
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13:40 -
14:10 |
Electroless Copper
Plating Process Applied on New Materials |
Yasuhiro
Sakata
Metal Finishing Senior Researcher, R&D Laboratory
Okuno Chemical Industries Co., Ltd. |
| Japanese |
We show "ATS
Series" that is Electroless Copper Plating Process applied on the latest
needs for making PWB. |
| Apply to |
TEL:06-6961-0886 / FAX:06-6963-0740
kaihatsu@okuno.co.jp |
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14:20 -
14:50 |
Flex and Flex/rigid
Processing Considerations and Experiences |
Gerd
Linka, Dr.
Business Manager, BTT-PTH
Atotech Germany GmbH |
| English |
We will show the
main considerations for flex and flex/rigid processing and discuss the influences
of materials and board designs on pre-treatment and metallisation. |
| Apply to |
TEL:045-937-6152
/ FAX:045-937-6134
muranush@atotech.co.jp |
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15:00 -
15:30 |
High Performance
Electroytic Copper Plating System (SPS) |
Kiyoshi
Ichikawa
Technical Group, Plating Plant Business Group, Plant Engineering Dept.
ALMEX Inc. |
| Japanese |
We introduce high
performance electroytic copper plating system (SPS) for high performance boards
(high-aspect,high-denstiy,via-filling, . . .) |
| Apply to |
TEL:0289-76-3111 / FAX:0289-76-3117
ichikawa-k1@almex.jp |
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15:40 -
16:10 |
High frequency trend of digital appliance and related materials |
Yasushi Shimada
Senior researcher, Laboratory for Circuit Boards and Materials, Research and Development Center
Hitachi Chemical Co., Ltd. |
| Japanese |
As the high speed data transform on PWB is required, we show the importance of the dielectric properties of the PWB materials and the advantages of the low transmission loss materials. |
| Apply to |
TEL:0296-20-2317 / FAX:0296-28-4637
yas-shimada@hitachi-chem.co.jp |
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| The Latest Technology Trends in Wet Process Equipment |
(A.M.) |
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10:30 -
11:00 |
Advancements in
pulse plating technology especially for thick printed circuit boards. |
Ingo
Ewert
Business Manager, BTT Panel/Pattern Plating
Atotech Germany GmbH |
| English |
The presentation
describes new developments for pulse plating technology, especially for the manufacturing
of thick circuit boards with high aspect ratio. |
| Apply to |
TEL:045-937-6152
/ FAX:045-937-6134
muranush@atotech.co.jp |
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11:10 -
11:40 |
Applications of
Reverse Pulse Plating to Various PCB Manufacturing |
Roy
Beunen
Process Engineer
DRPP Asia Limited |
| English |
Applications of
reverse pulse plating to PWB manufacturing are described based on the experiences
of DRPP, especially on HDI and back panels. |
| Apply to |
TEL:03-3728-9298
/ FAX:03-3728-9298
currentec.hirakawa@nifty.ne.jp
http://www.currentec.co.jp |
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11:50 -
12:20 |
Applications of
Reverse Pulse Plating to Various PCB Manufacturing |
Tadashi
Hirakawa
President, Currentec Inc.
DRPP Asia Limited |
| Japanese |
Applications of
reverse pulse plating to PWB manufacturing are described based on the experiences
of DRPP, especially on HDI and back panels. |
| Apply to |
TEL:03-3728-9298 / FAX:03-3728-9298
currentec.hirakawa@nifty.ne.jp
http://www.currentec.co.jp |
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| The Latest Process Trends in Lead-Free Soldering |
(p.m.) |
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13:00 -
13:30 |
Next Generation
of Multilayer Bonding for High-Performance Dielectric Materials in Compliance
with Lead-free Initiatives |
Patrick
Brooks
Principal Product Support Engineer, BTT-STT
Atotech Germany GmbH |
| English |
Atotech's new inner
layer bonding process gives superior bonding strength and thermal reliability
on advanced laminates and prepregs for lead-free assembly processes. |
| Apply to |
TEL:045-937-6152
/ FAX:045-937-6134
muranush@atotech.co.jp |
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13:40 -
14:10 |
Implementation
of lead-free wave soldering. |
Takashi
Fujimoto
Tokyo Office
Nihon Superior Co., Ltd. |
| Japanese |
We will focus on
challenges in the change for lead-free soldering and propose the relevant actions
for them, which are the concerns of assemblers. |
| Apply to |
TEL:06-6380-1121 / FAX:06-6380-1262
etsuko.n@nihonsuperior.co.jp |
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14:20 -
14:50 |
Next Generation
OSP for Lead-free soldering |
Yoshihiro
Kasyu
Fine Chemicals Sales Dept.
Shikoku Chemicals Corporation |
| Japanese |
Next generation
OSP "Glicoat-SMD" is the best alternative of HASLin terms of lead-free
solder requirement. |
| Apply to |
TEL:043-296-4104 / FAX:043-350-3580
fukudah@shikoku.co.jp |
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15:00 -
15:30 |
Pb free solder
(Sn-Ag-Cu-Ni-Ge) |
Masayuki
Hasegawa
Technical Advisor, Shenmao Micro Material Institute
Shenmao Technology Inc. |
| Japanese |
The Sn-Ag-Cu-Ni-Ge
solder as new Pb free solder, a solidification crack cannot occur easily. |
| Apply to |
TEL:042-946-1781 / FAX:042-946-1741
theresa@dream.com |
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15:40 -
16:10 |
High Phosphorus
Electroless Ni/Gold Plating for Lead free soldering |
Ken
Hashimoto
Chief, Product Marketing Department
Atotech Japan K.K. |
| Japanese |
High Phosphorus
ENIG layer has good performance about not only corrosion resistance but also Lead
free solder-joint and wet-ability. |
| Apply to |
TEL:045-937-6152 / FAX:045-937-6134
muranush@atotech.co.jp |
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| The Latest Material Trends in Patterning Process |
(a.m.) |
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10:30 -
11:00 |
Selective etching
of various metals and these applications |
Akiyama
Daisaku
Assistant Manager, R&D Center
Mec Company Ltd. |
| Japanese |
Metal selective
etching is one of important technique for making high performance PCB. We will
show some of our etching chemical and application. |
| Apply to |
TEL:06-6401-8170 / FAX:06-6401-8172
akiyama@mec-np.com |
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11:10 -
11:40 |
Crack resistance
ability of electroless Ni plating |
Hiroaki
Shibuya
Manager, Takatsuki Technical Center
Nikko Metal Plating Co., Ltd. |
| Japanese |
Electroless Ni plating
which is used mostly for PCB and electronic parts has troubles of crack resistance
ability.We introduce new product for those. |
| Apply to |
TEL:03-3585-8954 / FAX:03-3587-1967
nichimeta@n-m-p.co.jp |
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11:50 -
12:20 |
Colloid graphite
type direct metallization |
Koji
Saeki
Deputy General Manager, Fine Chemicals Sales Dept.
Shikoku Chemicals Corporation |
| Japanese |
Unique direct metallization
"Shadow" eliminates formaldehyde, and makes economical and reliable
conductive layer even for blind via and multilayer. |
| Apply to |
TEL:043-296-4104 / FAX:043-350-3580
fukudah@shikoku.co.jp |
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