June 2 High Density Electronics Packaging and Interconnection Technology (p.m.) 13:00 - 13:30 Evaluation of wettability for Pb free solder by our high temperature observation equipment. Masashi Nishimuro Assistant Manager, Development Design Dept. Sanyo Seiko Co., Ltd. Japanese I would like to introduce a case of evaluation of wettability for Pb free solder using our high temperature observation equipment:SP-5000DS. Apply to TEL:0426-60-1670 / FAX:0426-60-1671 t-eigyo@sanyoseiko.co.jp 13:40 - 14:10 Development of Optical Connection Devices Kyoichi Sasaki Technical Research Laboratory Tomoegawa Paper Co.,Ltd. Japanese Tomoegawa Paper Co., Ltd. offers new optical connection devices for a downsizing, a simple assembling, and a cost reduction of an optical circuit. Apply to FAX:054-257-1800 npi_jpca@tomoegawa.co.jp 14:20 - 14:50 Pb-furee soldering technique Kazuo Kawai SMT-technical adviser Yuyama Seisakushiyo Co.,Ltd Japanese Pb-furee soldering BGA/CSP&FPC Apply to FAX:06-6913-1396 jitusougiken@ybb.ne.jp 15:00 - 15:30 Application and development of New build-up method(AGSP) Yoshio Nakayama Engineering Group Leader, Engineering Group Chemitron Inc. Japanese We'd like to announce some of technology, that are expected to do great performance for high packaging density of next generation using our new build-up method(AGSP) Apply to TEL:03-5324-6041 / FAX:03-5324-6040 chemi01@sepia.ocn.ne.jp 15:40 - 16:10 Dvelopment of Printing System for TAB/COF Toshihiko Kurimasa Fine Process Electronics Div. Toray Engineering Co. Ltd. Japanese We have developped solder resist printing system,which build-in roll to roll system.We propose the solution by Toray printing system. Apply to TEL:03-3241-1769 / FAX:03-3271-7359 June 3 The Current Technology of High Quality/High Density Exprosure System (a.m.) 10:30 - 11:00 NEWEST Technology of UV Laser Exposure system Christian Buchner, Dr. Heidelberg Instruments MikroTechnik GmbH Japan Laser Corporation English Introduction of high accuracy UV laser-based non-contact projection exposure system with scaling capability for shrinkage compensation Apply to TEL:03-5285-0861 / FAX:03-5285-0861 proc@japanlaser.co.jp 11:10 - 11:40 NEWEST Technology of UV Laser Exposure system Tatsuya Uzuka Director, Application System Dept. Japan Laser Corporation Japanese Introduction of high accuracy UV laser-based non-contact projection exposure system with scaling capability for shrinkage compensation Apply to TEL:03-5285-0861 / FAX:03-5285-0861 proc@japanlaser.co.jp 11:50 - 12:20 High-productivity stepper Tetsuo Ishino Director,Department Manager/Sales&Marketing, Mejiro Precision, Inc. Cermatronics Boeki Co., Ltd. Japanese For manufacturing HDI PWB, MM Stepper is exposing equipment realizing high-productivity and high-resolution. Apply to TEL:03-3863-6812 / FAX:03-3863-6815 hiroseino@cerma.co.jp High Density PWB Imaging Process Technology (p.m.) 13:00 - 13:30 Projection Exposure System with Catedioptric System Duk Lee/Masaru Yamaga Optical system designing leader, Designing group, Exposure system division /machining group 1, Designing group, Exposure system division ORC Manufacturing Co., Ltd. Japanese Development of vertical projection exposure system with catedioptric system which realizes less chromatic aberration, high resolution and intensity. Apply to TEL:0424-87-0161 / FAX:0424-81-0508 pwb-sale@orc.co.jp 13:40 - 14:10 Magnified-Projection Step & Repeat Exposure System for Printed Circuit Boards Takumi Tanaka Director, General Manager of Engineering Division ADTEC Engineering Co., Ltd. Japanese Evaluation results are reported about the ultra-high resolution and the accurate overlay capability of ADTEC's Magnified-Projection Exposure System Apply to TEL:03-3433-4466 / FAX:03-3433-4330 sales@adtec-eng.co.jp 14:20 - 14:50 Expansion of Direct Imaging Kenichi Sudo DI Project Manager, Business System Division PENTAX Corporation Japanese To respond to increasing expectation on direct imaging for R&D or manufacturing process, PENTAX has developed direct imagers for new application. Apply to TEL:03-3960-5152 / FAX:03-3960-1920 info.bss@aoc.pentax.co.jp 15:00 - 15:30 The Complete Automated Imaging and Registration System by MIE Tadashi Hirakawa President, Currentec Inc. Multiline International Europe L. P. Japanese This paper describes new technologies and developments of the automated imaging and registration systems of MIE to attain higher density. Apply to TEL:03-3728-9298 / FAX:03-3728-9298 currentec.hirakawa@nifty.ne.jp http://www.currentec.co.jp 15:40 - 16:10 The Complete Automated Imaging and Registration System by MIE Paul Waldner President Multiline International Europe L. P. English This paper describes new technologies and developments of the automated imaging and registration systems of MIE to attain higher density. Apply to TEL:03-3728-9298 / FAX:03-3728-9298 currentec.hirakawa@nifty.ne.jp http://www.currentec.co.jp June 4 Technological Trends of Advanced Packaging and Processing Equipment (a.m.) 10:30 - 11:00 New application by vacuum printing method Takashi Shiga Micro-Patterning Equipment Sales Section, Fine Process Sales Department Electronics Div. Toray Engineering Co.Ltd. Japanese Technical presentation will be made on the unique vacuum printing method considered as useful countermeasures against void issue in the applications. Apply to TEL:03-3241-1769 / FAX:03-3271-7359 11:10 - 11:40 Pill's Vacuum Etching Technology Tadashi Hirakawa President, Currentec Inc. Pill. e. K. Japanese Features of Pill's Vacuum Etching Technology is described. The excellent uniformity expands applications to fine features and large panels. Apply to TEL:03-3728-9298 / FAX:03-3728-9298 currentec.hirakawa@nifty.ne.jp http://www.currentec.co.jp 11:50 - 12:20 Pill's Vacuum Etching Technology Frank Baron Sales Manager Pill. e. K. English Features of Pill's Vacuum Etching Technology is described. The excellent uniformity expands applications to fine features and large panels. Apply to TEL:03-3728-9298 / FAX:03-3728-9298 currentec.hirakawa@nifty.ne.jp http://www.currentec.co.jp