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Introduction |
Off-shore production of printed wiring board (PWG,
often written simply board in this book) by Japanese manufacturers is
increasing significantly as a result of economic globalization. This book is
prepared as an introductory textbook to prepare for the First and Second Level
Technical Skill Tests especially for non-Japanese technicians who come to
Japan for the training of the PWB technology. This book is an excerpt of the
book, "Introduction to the Printed Wiring Board Technology" one of the
Purintoban-Juku series of JPCA written by the author.
Technicians coming to Japan from abroad have a limited
knowledge of the PWB technology in addition to the handicap of difficulty in
understanding the Japanese language. The text in the Japanese edition of this
book is restated using simpler Japanese words for easy understanding of the
technology. The Japanese readings are added after Chinese characters used in
the text (not applicable to this text in English). Some descriptions of terms
are also changed for this purpose.
This book states only the very basics of the PWB
technology. It is difficult to train technicians by this book alone for the
entire fields of the PWB technology. This book may be used to obtain
introductory knowledge of the technology for technicians who come to Japan for
the first time for technical training. It is strongly encouraged to study
further details of the technology using other textbooks of this series of the
"Purintoban-Juku".
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Contents |
1. Types of Printed Wiring Board
1.1 Single-sided Board
1.2 Double-sided Board
1.3 Multilayer Board
2. Copper Clad Laminate
2.1 Structure
2.2 Manufacturing Process of Copper Clad Laminate, Prepreg, and Shielded Board
2.3 Specifications of Copper Clad Laminate
3. Solder Resist and Symbol Mark
4. Manufacturing Process of Single-sided Board
4.1 Manufacturing Process
4.2 Formation of Conductor Pattern (Etching)
5. Manufacturing of Double-sided Boar
5.1 Manufacturing Process
5.2 Formation of a Via
6. Manufacturing of Multilayer Board
6.1 Manufacturing Process
6.2 Lamination
7. Formation of Patterns
7.1 Formation of Conductor Pattern
7.2 Formation of Resist Pattern
7.3 Elements of Screen Printing
7.4 Structure of Dry Film
8. Hole Machining
9. Plating
10. Tooling Hole
11. Quality of Printed Wiring Board
11.1 Defects in Conductor Pattern
11.2 Defects in Plated Through-hole
12. Design
12.1 Circuit Diagram Example
12.2 Design Rule
13. Component Assembly
13.1 Electronic Components and Types of Assembly
13.2 Size Electronic Components and Pitch between Terminals
14. Terms used in Printed Wiring Board Technology
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