JPCA Book Shop Back top next
JPCA Standard
Copper-clad laminates for printed wiring boards - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1GHz) and flammability (vertical burning test), copper-clad
JPCA-HCL01-2009
Copper-clad laminates for printed wiring boards - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1GHz) and flammability (vertical burning test), copper-clad
JPCA-HCL02-2009
Copper-clad laminates for printed wiring boards - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1GHz) and flammability (vertical burning test), copper-clad
JPCA-HCL21-2009
Copper-clad laminates for printed wiring boards - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1GHz) and flammability (vertical burning test), copper-clad
JPCA-HCL22-2009
Date of issue: June 2009
Price 3,150 Yen
A4 Size 103 Pages
CONTENTS 

1 Scope
2 Normative references
3 Materials and construction
 3.1 Resin System
 3.2 Metal foil
 3.3 Reinforcement
4 Electrical properties
5 Non-electrical properties of the copper-clad laminate
 5.1 Appearance of the copper-clad sheet
  5.1.1  Indentations (pits and dents)
  5.1.2 Wrinkles
  5.1.3 Scratches
  5.1.4 Raised areas
  5.1.5 Surface waviness
 5.2 Appearance of the unclad face
 5.3 Laminate thickness
 5.4 Bow and twist
 5.5 Properties related to the copper foil bond
 5.6 Punching and machining
 5.7 Dimensional stability
 5.8 Sheet sizes
  5.8.1 Typical sheet sizes
  5.8.2 Tolerances for sheet sizes
  5.8.3 Rectangularity for sheet sizes
 5.9 Cut panels
  5.9.1 Cut panel sizes
  5.9.2 Size tolerance for cut panels
  5.9.3 Rectangularity of cut panels
6 Non-electrical properties of the base material after complete removal of the copper foil
 6.1 Appearance of the dielectric base material
 6.2 Flexural strength
 6.3 Flammability
 6.4 Water absorption
 6.5 Measling
 6.6 Glass transition temperature and cure factor
7. Packaging and identification
8  Ordering information
Order Sheet Back top next
JPCA-Japan Electronics Packaging and Circuits Association