Printed wiring board has been used in various equipment including electronic circuits and wide
ranges of equipment requiring electronic circuitry. It is expected to expand its applications
to wider ranges of applications. However, unification of design, production and tests is not
available yet in each step of the process and effective realization of design, effective
production process reduction are not realized yet. Effective use of design information of
boards necessary in production of boards is now an urgent requirement by means of automation
and rationalization of processes. The committee of developing data format of printed wiring
boards in JPCA was formed in July 1992. The data format committee has been working to develop
a format applicable to different CAD systems, highly requested by various applications. They
developed “JPCA data format specification” in August 1993. The CAD technology then was not
widely used yet and communication among printed wiring board manufacturers was not sufficient
enough. In 2008, production of device embedded substrates started and 3D CAD to describe the
status of device embedding was required in the design stage of the device. Design information
of hole formation, appearance test, electric test were necessary to evaluate performance of
products. A committee of data format standardization was formed in the committee of device
embedded substrate technology in JPCA in July 2011. The new committee is to develop data
format for device embedded substrate standard for circuit board, electric test equipment,
image test equipment, and assembly equipment together with experts from related manufacturers.
The present document, EB02, was developed to supply the required information to the industry
and we are also preparing an international standard by proposing this document to IEC
(International Electrotechnical Commission).
The main issues of this document are the following two.
1. Data of board CAD and of FUJIKO and both necessary data of production facility and of test
equipment producers are compiled to make it possible to unify the necessary information in
production as shown in Table 1-1.
2. Data format is formed to make it possible simulation of design, production and
characteristics of device embedded substrate. Know-how of realizing total assembly
technology is necessary for printed wiring board production technology based on
characteristics of device embedded substrate.
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